mc33981bpna/r2 Freescale Semiconductor, Inc, mc33981bpna/r2 Datasheet - Page 34

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mc33981bpna/r2

Manufacturer Part Number
mc33981bpna/r2
Description
Single High-side Switch 4.0 M , Pwm Clock Up To 60khz
Manufacturer
Freescale Semiconductor, Inc
Datasheet
Device on Thermal Test Board
34
33981
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Material:
Outline:
Area A:
Ambient Conditions:
Transparent Top View
12.0 mm x 12.0 mm Body
33981 Pin Connections
OUT
with exposed pads
15
0.90 mm Pitch
16-Pin PQFN
VPWR
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
80 mm x 100 mm board area,
including edge connector for thermal
testing
Cu heat-spreading areas on board
surface
Natural convection, still air
GND
13
14
OUT
16
Figure 45. Thermal Test Board
Table 8. Thermal Resistance Performance
ambient air.
die that is heated. Index n refers to the number of the die
where the junction temperature is sensed.
Resistance
Ρ
Thermal
θJAmn
R
This device is a dual die package. Index m indicates the
A
θ
JA
is the thermal resistance between die junction and
Area A
(mm
300
600
0
2
)
Analog Integrated Circuit Device Data
1 = Power Chip, 2 = Logic Chip (°C/W)
m = 1,
n = 1
66
47
43
Freescale Semiconductor
m = 1, n = 2
m = 2, n = 1
51
37
34
m = 2,
n = 2
84
73
70

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