tda5240t NXP Semiconductors, tda5240t Datasheet - Page 18

• Manufacturer Part Number: tda5240t
• Description: Brushless Dc Motor Drive Circuit
• Manufacturer: NXP Semiconductors

.
There is no soldering
Philips Semiconductors
SOLDERING
Introduction
surface mounted components
surface mounted
used.
This text gives a very brief insight to a complex technology.
printed-circuit
Several techniques
50 and 300 seconds
Wave soldering
Wave soldering techniques
A mildly-activated
Reflow
Reflow soldering techniques
Reflow soldering
Preheating
.A
.The
.The
During placement
applied by screen printing, pin transfer or syringe dispensing.
Maximum
than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a
dedicated
"IC Package Databook"
10 seconds, if cooled to less than 150 oC within 6 seconds. Typical dwell time is 4 seconds at 250 oC.
Repairing
Fix the component
November
should be used.
Brushless
double-wave
longitudinal
package footprint
soldering
permissible
tool, all other leads can be soldered
soldered
96
is necessary
board by screen printing, stencilling
requires solder paste (a suspension
ICs, or for printed-circuits
(a turbulent
flux will eliminate the need for removal of corrosive
DC motor drive circuit
and before soldering,
axis of the package footprint
by first soldering
exist for reflowing; for example, thermal conduction
depending
joints
method that is ideal for all IC packages.
solder temperature
(order code 9398 652 90011 ).
to dry the paste and evaporate
must incorporate
can be used for all sa packages
are suitable for all sa packages.
wave with high upward pressure followed by a smooth laminar wave) soldering
are mixed on one printed-circuit
on heating method. Typical reflow temperatures
two diagonally-
the package must be fixed with a droplet of adhesive.
solder thieves at the downstream
is 260 oC, and maximum
with high population
in one operation within 2 to 5 seconds between 270 and 320 °C.
must be parallel to the solder flow-
or pressure-syringe
opposite end leads. Use only a low voltage soldering
of fine solder particles, flux and binding agent) to be applied to the
the binding agent. Preheating
18/19
A more in-depth account of soldering
if the following
Wave soldering is often preferred when through-hole
The package can be soldered after the adhesive
board. However, wave soldering is not always suitable for
densities.
duration of package immersion
residues in most applications.
dispensing
by heated belt. Dwell times vary between
In these situations
conditions
end.
range from 215 to 250 °C.
before package
duration:
are observed:
reflow soldering
The adhesive
ICs can be found in our
45 minutes at 45 °C.
Product specification
placement.
in solder is
TDA5240T
iron (less
technique
can be
is often
is cured.
and