ip4777cz38/v NXP Semiconductors, ip4777cz38/v Datasheet
ip4777cz38/v
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ip4777cz38/v Summary of contents
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IP4777CZ38 DVI and HDMI interface ESD protection, DCC buffering, hot plug control, multiplexing option and backdrive protection Rev. 01 — 15 April 2008 1. General description The IP4777CZ38 is designed for HDMI transmitter host interface protection. The IP4777CZ38 includes DDC ...
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... N PC graphic card N Game console N HDMI picture performance quality enhancer module 4. Ordering information Table 1. Type number IP4777CZ38 IP4777CZ38/V IP4777CZ38_1 Objective data sheet Ordering information Package Name Description TSSOP38 plastic thin shrink small outline package: 38 leads; body width 4.4 mm; lead pitch 0.5 mm Rev. 01 — 15 April 2008 ...
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... NXP Semiconductors 5. Functional diagram TMDS_D2+ TMDS_D2 TDMS_BIAS HOT_PLUG_DET_OUT TMDS_BIAS CEC_OUT LIMITER Fig 1. Functional diagram IP4777CZ38_1 Objective data sheet TMDS_D1+ TMDS_BIAS TMDS_D1 TMDS_GND V CC(5V0) HOT_PLUG_DET_IN DDC_CLK_OUT CC(3V3) CEC_IN DDC_DAT_OUT SLEW RATE Rev. 01 — 15 April 2008 IP4777CZ38 DVI and HDMI interface ESD protection ...
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... TMDS_D1+ TMDS_GND 8 n.c. 9 IP4777CZ38/V 10 TMDS_D0+ 11 TMDS_GND n.c. 12 TMDS_CLK TMDS_GND n.c. 15 CEC_IN 16 17 DDC_CLK_IN 18 DDC_DAT_IN HOT_PLUG_DET_IN 19 Pin configuration IP4777CZ38/V Rev. 01 — 15 April 2008 IP4777CZ38 DVI and HDMI interface ESD protection 38 TMDS_BIAS 37 V CC(3V3) 36 GND 35 n.c. 34 TMDS_D2 33 TMDS_GND 32 n.c. 31 TMDS_D1 30 TMDS_GND 29 n.c. 28 TMDS_D0 ...
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... TMDS_GND TMDS_CLK+ n.c. TMDS_GND CEC_IN DDC_CLK_IN DDC_DAT_IN HOT_PLUG_DET_IN HOT_PLUG_DET_OUT DDC_DAT_OUT DDC_CLK_OUT CEC_OUT TMDS_GND TMDS_CLK n.c. TMDS_GND TMDS_D0 n.c. TMDS_GND TMDS_D1 TMDS_GND TMDS_D2 n.c. IP4777CZ38_1 Objective data sheet Pin description Pin IP4777CZ38 IP4777CZ38 ...
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... NXP Semiconductors Table 2. Symbol GND V CC(3V3) TMDS_BIAS [1] Type number IP4777CZ38/V is pin compatible with type number IP4776CZ38. 7. Limiting values Table 3. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter ESD P tot T stg [1] Connector side pins: TMDS_D2+, TMDS_D2 , TMDS_D1+, TMDS_D1 , TMDS_D0+, TMDS_D0 ...
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... NXP Semiconductors 8. Static characteristics Table 4. TMDS protection circuit unless otherwise specified. amb Symbol Parameter Zener diode V Zener diode breakdown BRzd voltage R dynamic resistance dyn Protection diode I back current bck I reverse leakage current L(r) V forward voltage F V positive transient channel CL(ch)trt(pos) ...
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... NXP Semiconductors Table 5. DDC circuit …continued CC(3V3) CC(5V0) Symbol Parameter Board side: pins DDC_CLK_IN and DDC_DAT_IN Used as input V HIGH-level input voltage IH V LOW-level input voltage IL I LOW-level input current IL V input clamping voltage IK I input leakage current LI C input capacitance ...
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... NXP Semiconductors Table 6. CEC circuit 5.5 V; GND = CC(3V3) Symbol Parameter Board side: input pin CEC_IN C level shifting input capacitance I(ch-GND)(levsh) from channel to ground SR rising slew rate r N-FET V on-state voltage drop on Connector side: output pin CEC_OUT I output leakage current ...
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... NXP Semiconductors Table 8. Hot plug control circuit CC(5V0) CC(3V3) Symbol Parameter Connector side: output pin HOT_PLUG_DET_OUT V HIGH-level input voltage IH I LOW-level input current IL I input leakage current LI C input capacitance i R output resistance o 9. Dynamic characteristics Table 9. DDC circuits 5.5 V ...
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... NXP Semiconductors a. Propagation delay t input: board side output: connector side (1) Dotted line indicates effect without slew rate accelerator. b. Propagation delay t Fig 4. IP4777CZ38_1 Objective data sheet input: board side t PLH output: connector side PLH 1. PHL THL and transition time ...
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... NXP Semiconductors input: connector side output: board side a. Propagation delay output to input and transition time input Fig 5. IP4777CZ38_1 Objective data sheet 0.3V CC(5V0) t PHL THL Connector side to board side operation Rev. 01 — 15 April 2008 IP4777CZ38 DVI and HDMI interface ESD protection ...
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... NXP Semiconductors 10. Application information 10.1 TMDS To protect the TMDS lines and also to comply with the impedance requirements of the HDMI specification, the IP4777CZ38 provides ESD protection with a low capacitive load. The dominant value for the TMDS line impedance is the capacitive load to ground. The IP4777CZ38 has a capacitive load of only 0 ...
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... NXP Semiconductors 0.3V CC(5V0) (1) Dotted line indicates effect without slew rate accelerator. Fig 8. DDC output waveform 10.3 Hot plug detect circuit The IP4777CZ38 includes a hot plug detect circuit that simplifies the hot plug application. The circuit generates a standard logic level from the hot plug signal. ...
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... NXP Semiconductors Fig 10. CEC module 0.8 V (1) Dotted line indicates effect without slew rate limiter. Fig 11. CEC output waveform 10.5 Backdrive protection The HDMI contains various signals which can partly supply current into an HDMI device that is powered down. Typically, the DDC lines and the CEC signals can force 5 V into the switched off device. ...
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... NXP Semiconductors 10.6 Schematic view of application Only a few external components are needed at the application to adapt the HDMI port to the parameters of the HDMI transmitter device. TMDS_CLK+ DDC_CLK_IN DDC_DAT_IN HOTPLUG_DET_IN Fig 13. Schematic view of IP4777CZ38 application IP4777CZ38_1 Objective data sheet +5.0 V +3.3 V 100 1.5 1 enable ...
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... NXP Semiconductors 10.7 Typical application The optimized pinning variant simplifies the printed-circuit board design. The pinning optimizes the design of the microstrip lines for defined impedance. Underneath the device a solid ground plane is part of the microstrip lines. This application requires only a few external components to adapt the HDMI port to the parameters of the HDMI transmitter device or HDMI multiplexer ...
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... NXP Semiconductors 11. Test information Fig 15. Test circuit for DDC and CEC lines Table 10. Test DDC lines CEC line IP4777CZ38_1 Objective data sheet V CC(3V3 term See Table 10 for test data termination resistance should be equal to output impedance Z term R = load resistance load capacitance. ...
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... NXP Semiconductors 12. Package outline TSSOP38: plastic thin shrink small outline package; 38 leads; body width 4.4 mm; lead pitch 0 pin 1 index 1 e DIMENSIONS (mm are the original dimensions). A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.85 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...
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... NXP Semiconductors 13. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 13.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 13.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... NXP Semiconductors Fig 17. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 14. Abbreviations Table 13. Acronym CEC DDC DVD ESD FET GPIO HD HDMI MOSFET RoHS SD TMDS 15. Glossary HDMI sink — ...
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... NXP Semiconductors 16. Revision history Table 14. Revision history Document ID Release date IP4777CZ38_1 20080415 IP4777CZ38_1 Objective data sheet DVI and HDMI interface ESD protection Data sheet status Change notice Objective data sheet - Rev. 01 — 15 April 2008 IP4777CZ38 Supersedes - © NXP B.V. 2008. All rights reserved. ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 Limiting values Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . 10 10 Application information 10.1 TMDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 10.2 DDC circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 10.3 Hot plug detect circuit . . . . . . . . . . . . . . . . . . . 14 10.4 CEC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 10 ...