ip4778cz38/v NXP Semiconductors, ip4778cz38/v Datasheet
ip4778cz38/v
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ip4778cz38/v Summary of contents
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IP4778CZ38 HDMI ESD protection, DDC buffering and hot plug control Rev. 01 — 10 April 2008 1. General description The IP4778CZ38 is designed for HDMI receiver host interface protection. The IP4778CZ38 includes DDC buffering, slew rate acceleration and decoupling, hot ...
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... PC monitors N HDMI buffer modules (extensions of HDMI cable length) N HDMI picture performance quality enhancer modules 4. Ordering information Table 1. Type number IP4778CZ38 IP4778CZ38/V IP4778CZ38_1 Objective data sheet HDMI ESD protection, DDC buffering and hot plug control Ordering information Package Name Description TSSOP38 plastic thin shrink small outline package; 38 leads; ...
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... NXP Semiconductors 5. Functional diagram TMDS_D2+ TMDS_D2 V TMDS_BIAS CC(5V0) HOT_PLUG_DET_OUT TMDS_BIAS CEC_OUT LIMITER Fig 1. Functional diagram IP4778CZ38_1 Objective data sheet HDMI ESD protection, DDC buffering and hot plug control TMDS_D1+ TMDS_BIAS TMDS_D1 TMDS_GND ENABLE HOT_PLUG_DET_IN 1 k DDC_CLK_OUT CC(3V3) CEC_IN DDC_DAT_OUT ...
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... TMDS_D2+ 4 TMDS_GND 5 n. TMDS_D1+ TMDS_GND 8 n.c. 9 IP4778CZ38/V 10 TMDS_D0+ 11 TMDS_GND n.c. 12 TMDS_CLK TMDS_GND n.c. 15 CEC_IN 16 17 DDC_CLK_IN 18 DDC_DAT_IN HOT_PLUG_DET_IN 19 Pin configuration of IP4778CZ38/V Rev. 01 — 10 April 2008 IP4778CZ38 38 TMDS_BIAS 37 V CC(3V3) 36 GND 35 n.c. 34 TMDS_D2 33 TMDS_GND 32 n.c. 31 TMDS_D1 30 TMDS_GND 29 n.c. 28 TMDS_D0 27 TMDS_GND 26 n.c. 25 TMDS_CLK 24 ...
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... DDC_CLK_IN DDC_DAT_IN HOT_PLUG_DET_IN HOT_PLUG_DET_OUT DDC_DAT_OUT DDC_CLK_OUT CEC_OUT TMDS_CLK TMDS_GND n.c. TMDS_D0 TMDS_GND n.c. TMDS_D1 TMDS_GND IP4778CZ38_1 Objective data sheet HDMI ESD protection, DDC buffering and hot plug control Pin description Pin IP4778CCZ38 IP4778CZ38 ...
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... CEC_OUT, DDC_DAT_OUT and DDC_CLK_OUT, HOT_PLUG_DET_OUT. [2] Board side pins: CEC_IN, DDC_DAT_IN and DDC_CLK_IN, HOT_PLUG_DET_IN, ENABLE. IP4778CZ38_1 Objective data sheet HDMI ESD protection, DDC buffering and hot plug control Pin description …continued Pin IP4778CCZ38 IP4778CZ38 Figure 15 ...
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... NXP Semiconductors 8. Static characteristics Table 4. TMDS protection circuit unless otherwise specified. amb Symbol Parameter Zener diode V Zener diode breakdown BRzd voltage R dynamic resistance dyn Protection diode I back current bck I reverse leakage current L(r) V forward voltage F V positive transient channel CL(ch)trt(pos) ...
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... NXP Semiconductors Table 5. DDC circuit …continued CC(3V3) CC(5V0) Symbol Parameter Board side: pins DDC_CLK_IN and DDC_DAT_IN Used as input V HIGH-level input voltage IH V LOW-level input voltage IL I LOW-level input current IL V input clamping voltage IK I input leakage current LI C input capacitance ...
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... NXP Semiconductors Table 6. CEC circuit 5.5 V; GND = CC(3V3) Symbol Parameter Board side: input pin CEC_IN C level shifting input capacitance I(ch-GND)(levsh) from channel to ground SR rising slew rate r N-FET V on-state voltage drop on Connector side: output pin CEC_OUT I input leakage current ...
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... NXP Semiconductors Table 8. Hot plug control circuit CC(5V0) CC(3V3) Symbol Parameter Connector side: output pin HOT_PLUG_DET_OUT V HIGH-level input voltage IH I LOW-level input current IL I input leakage current LI C input capacitance i R output resistance o 9. Dynamic characteristics Table 9. DDC circuits 5.5 V ...
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... NXP Semiconductors 9.1 AC Waveforms a. Propagation delay t input: board side output: connector side (1) Dotted line indicates effect without slew rate accelerator. b. Propagation delay t Fig 4. IP4778CZ38_1 Objective data sheet HDMI ESD protection, DDC buffering and hot plug control input: board side t PLH output: connector side PLH 1 ...
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... NXP Semiconductors output: connector side input: board side a. Propagation delay output to input and transition time input Fig 5. IP4778CZ38_1 Objective data sheet HDMI ESD protection, DDC buffering and hot plug control 0.3V CC(5V0) t PHL THL Connector side to board side operation Rev. 01 — 10 April 2008 IP4778CZ38 5 ...
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... NXP Semiconductors 10. Application information 10.1 TMDS To protect the TMDS lines and also to comply with the impedance requirements of the HDMI specification, the IP4778CZ38 provides ESD protection with a low capacitive load. The dominant value for the TMDS line impedance is the capacitive load to ground. The IP4778CZ38 has a capacitive load of only 0 ...
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... NXP Semiconductors 0.3V CC(5V0) (1) Dotted line indicates effect without slew rate accelerator. Fig 8. DDC output waveform 10.3 Hot plug driver circuit The IP4778CZ38 includes a hot plug driver circuit that simplifies the hot plug application. The circuit can be connected directly to GPIO pins. The hot plug control input is actively pulled LOW to ensure that at system standby or startup, the hot plug signal is HIGH even if a GPIO pin 3-state condition ...
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... NXP Semiconductors Fig 10. CEC module 0.8 V (1) Dotted line indicates effect without slew rate limiter. Fig 11. CEC output waveform 10.5 Multiplexing HDMI interface ports can exist on an HDMI receiver. The DDC and hot plug signals are both needed to support various HDMI connectors, multiplexing and switching of the TMDS lines ...
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... NXP Semiconductors Fig 12. Example of multiplexing both DDC and hot plug The combination of a TMDS switch and the IP4778CZ38 is a cost-effective way to attain various HDMI ports by using a single input HDMI receiver device. The Enable signal activates the HDMI DDC and hot plug lines at the port that is selected by the system controller ...
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... NXP Semiconductors 10.7 Application schematic Figure 14 interface to an HDMI port. This application requires only a few external components to adapt the HDMI port to the parameters of the HDMI receiver device or HDMI multiplexer. 3.3 V enable TMDS_D2+ TMDS_D2 GND TMDS_D1+ TMDS_D1 GND TMDS_D0+ TMDS_D0 GND TMDS_CLK+ TMDS_CLK GND ...
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... NXP Semiconductors 10.8 Typical application 5.0 V enable TMDS_D2+ TMDS_D2 GND TMDS_D1+ TMDS_D1 GND TMDS_D0+ TMDS_D0 GND TMDS_CLK+ TMDS_CLK GND CEC_IN DDC_CLK_IN DDC_DAT_IN HOT_PLUG_DET_IN Fig 15. Application showing optimized PCB microstrip lines This application ensures that the EDID (stored in the EEPROM) can be read out in Standby mode, even if long cables are used, to guarantee correct CEC wake-up handling. ...
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... NXP Semiconductors 11. Test information Fig 16. Test circuit for DDC and CEC lines Table 10. Test DDC lines CEC line IP4778CZ38_1 Objective data sheet HDMI ESD protection, DDC buffering and hot plug control V CC(3V3 term See Table 10 for test data termination resistance should be equal to output impedance Z ...
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... NXP Semiconductors 12. Package outline TSSOP38: plastic thin shrink small outline package; 38 leads; body width 4.4 mm; lead pitch 0 pin 1 index 1 e DIMENSIONS (mm are the original dimensions). A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.85 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...
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... NXP Semiconductors 13. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 13.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 13.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... NXP Semiconductors Fig 18. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 14. Abbreviations Table 13. Acronym CEC DDC DVD DVI EDID ESD FET GPIO HDM HDMI MOSFET ...
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... NXP Semiconductors 16. Revision history Table 14. Revision history Document ID Release date IP4778CZ38_1 20080410 IP4778CZ38_1 Objective data sheet HDMI ESD protection, DDC buffering and hot plug control Data sheet status Change notice Objective data sheet - Rev. 01 — 10 April 2008 IP4778CZ38 Supersedes - © NXP B.V. 2008. All rights reserved. ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 Limiting values Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . 10 9.1 AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . 11 10 Application information 10.1 TMDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 10.2 DDC circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 10.3 Hot plug driver circuit . . . . . . . . . . . . . . . . . . . 14 10 ...