w83697 Winbond Electronics Corp America, w83697 Datasheet - Page 27

no-image

w83697

Manufacturer Part Number
w83697
Description
Winbond I/o
Manufacturer
Winbond Electronics Corp America
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
w83697HF
Manufacturer:
Winbond
Quantity:
228
Part Number:
w83697HF
Manufacturer:
WINBOND
Quantity:
8
Part Number:
w83697HF
Manufacturer:
WINBOND
Quantity:
8
Part Number:
w83697HF
Manufacturer:
WINBOND/华邦
Quantity:
20 000
Company:
Part Number:
w83697HF
Quantity:
500
Company:
Part Number:
w83697HF
Quantity:
500
Part Number:
w83697HG
Manufacturer:
Winbond
Quantity:
1 000
Part Number:
w83697HG
Manufacturer:
Nuvoton Technology Corporation of America
Quantity:
10 000
Part Number:
w83697SF
Manufacturer:
Winbond
Quantity:
39
Part Number:
w83697SF
Manufacturer:
IDT
Quantity:
15
Part Number:
w83697UF
Manufacturer:
WINBOND
Quantity:
460
Part Number:
w83697UG
Manufacturer:
Nuvoton Technology Corporation of America
Quantity:
10 000
Part Number:
w83697UG
Manufacturer:
WINBOND/华邦
Quantity:
20 000
2. LPC (LOW PIN COUNT) INTERFACE
LPC interface is to replace ISA interface serving as a bus interface between host (chip-set) and peripheral
(Winbond I/O). Data transfer on the LPC bus are serialized over a 4 bit bus. The general characteristics of
the interface implemented in Winbond LPC I/O are:
Comparing to its ISA counterpart, LPC implementation saves up to 40 pin counts free for integrating more
devices on a single chip.
The transition from ISA to LPC is transparent in terms of software which means no BIOS or device driver
update is needed except chip-specific configuration.
One control line, namely LFRAME#, which is used by the host to start or stop transfers. No peripherals
drive this signal.
The LAD[3:0] bus, which communicates information serially. The information conveyed are cycle type,
cycle direction, chip selection, address, data, and wait states.
MR (master reset) of Winbond ISA I/O is replaced with a active low reset signal, namely LRESET#, in
Winbond LPC I/O.
An additional 33 MHz PCI clock is needed in Winbond LPC I/O for synchronization.
DMA requests are issued through LDRQ#.
Interrupt requests are issued through SERIRQ.
Power management events are issued through PME#.
- 18 -
Publication Release Date:Feb. 2002
W83697HF
Revision 0.70

Related parts for w83697