tea1521t-n2 NXP Semiconductors, tea1521t-n2 Datasheet

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tea1521t-n2

Manufacturer Part Number
tea1521t-n2
Description
Tea152x Family Smps Ics For Low-power Systems
Manufacturer
NXP Semiconductors
Datasheet
1.TEA1521T-N2.pdf (20 pages)
1. General description
2. Features
The TEA152x family STARplug+ is a Switched Mode Power Supply (SMPS) controller IC
that operates directly from the rectified universal mains. It is implemented in the
high-voltage EZ-HV SOI process, combined with a low-voltage BiCMOS process. The
device includes a high-voltage power switch and a circuit for start-up directly from the
rectified mains voltage.
A dedicated circuit for valley switching is built in, which makes a very efficient slim-line
electronic power plug concept possible.
In its most basic version of application, the TEA152x family acts as a voltage source.
Here, no additional secondary electronics are required. A combined voltage and current
source can be realized with minimum costs for external components. Implementation of
the TEA152x family renders an efficient and low cost power supply system.
TEA152x family
SMPS ICs for low-power systems
Rev. 02 — 25 January 2006
Designed for general purpose supplies up to 30 W
Integrated power switch:
Operates from universal AC mains supplies (80 V to 276 V)
Adjustable frequency for flexible design
RC oscillator for load insensitive regulation loop constant
Valley switching for minimum switch-on loss
Frequency reduction at low power output makes low standby power possible
(< 100 mW)
Adjustable overcurrent protection
Undervoltage protection
Temperature protection
Short-circuit winding protection
Simple application with both primary and secondary (opto) feedback
Available in DIP8 and SO14 packages
TEA1520: 48 ; 650 V
TEA1521: 24 ; 650 V
TEA1522: 12 ; 650 V
TEA1523: 6.5 ; 650 V
Product data sheet

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tea1521t-n2 Summary of contents

Page 1

TEA152x family SMPS ICs for low-power systems Rev. 02 — 25 January 2006 1. General description The TEA152x family STARplug Switched Mode Power Supply (SMPS) controller IC that operates directly from the rectified universal mains implemented ...

Page 2

Philips Semiconductors 3. Applications Chargers Adapters Set Top Box (STB) DVD CD(R) TV/monitor standby supplies PC peripherals Microcontroller supplies in home applications and small portable equipment, etc. 4. Quick reference data Table 1: Symbol V drain R DSon V CC ...

Page 3

... Ordering information Type number Package Name Description TEA1520P DIP8 plastic dual in-line package; 8-leads (300 mil) TEA1521P TEA1522P TEA1523P TEA1520T SO14 plastic small outline package; 14-leads; body width 3.9 mm TEA1521T TEA1522T 6. Block diagram 10) GND stop 3 (6) OSCILLATOR RC ...

Page 4

Philips Semiconductors 7. Pinning information 7.1 Pinning Fig 2. Pin configuration DIP8 7.2 Pin description Table 3: Symbol V CC GND GND GND GND RC REG AUX GND GND SOURCE n.c. n.c. DRAIN TEA152X_FAM_2 Product data sheet ...

Page 5

Philips Semiconductors 8. Functional description The TEA152x family is the heart of a compact flyback converter, with the IC placed at the primary side. The auxiliary winding of the transformer can be used for indirect feedback to control the isolated ...

Page 6

Philips Semiconductors 8.4 Valley switching A new cycle is started when the primary switch is switched on (see certain time (determined by the oscillator voltage RC and the internal regulation level), the switch is turned off and the secondary stroke ...

Page 7

Philips Semiconductors Figure 5 the output voltage V the factor N (determined by the turns ratio of the transformer). system switches exactly at minimum drain voltage for ringing frequencies of 480 kHz, thus reducing the switch-on losses to a minimum. ...

Page 8

Philips Semiconductors 8.9 Overtemperature protection An accurate temperature protection is provided in the device. When the junction temperature exceeds the thermal shutdown temperature, the IC stops switching. During thermal protection, the IC current is lowered to the start-up current. The ...

Page 9

Philips Semiconductors 9. Limiting values Table 4: In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured with respect to ground; positive currents flow into the device; pins V current driven and pins REG and AUX ...

Page 10

Philips Semiconductors 10. Thermal characteristics Table 5: Symbol R th(j-a) [1] Thermal resistance R printed-circuit board. See the TEA152x application notes for details. 11. Characteristics Table overtemperature; all voltages are measured with respect to ...

Page 11

Philips Semiconductors Table overtemperature; all voltages are measured with respect to ground; currents are amb positive when flowing into the IC; unless otherwise specified. Symbol V REG(clamp) Valley switching dV/dt valley f valley t ...

Page 12

Philips Semiconductors 12. Application information mains R1 Fig 6. Primary sensed application; configuration for TEA152xP Further application information can be found in the TEA152x application notes. 13. Test information 13.1 Quality information The General Quality Specification for Integrated Circuits, SNW-FQ-611 ...

Page 13

Philips Semiconductors 14. Package outline DIP8: plastic dual in-line package; 8 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. ...

Page 14

Philips Semiconductors SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. ...

Page 15

Philips Semiconductors 15. Handling information Inputs and outputs are protected against electrostatic discharge in normal handling. However completely safe you must take normal precautions appropriate to handling integrated circuits. 16. Soldering 16.1 Introduction This text gives a very ...

Page 16

Philips Semiconductors Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow peak temperatures range ...

Page 17

Philips Semiconductors 16.3.3 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage ( less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 ...

Page 18

Philips Semiconductors 17. Abbreviations Table 8: Acronym BiCMOS DMOS ESR EZ-HV SOI FET PWM SMPS SOPS 18. Revision history Table 9: Revision history Document ID Release date TEA152X_FAM_2 20060125 • Modifications: The format of this data sheet has been redesigned ...

Page 19

Philips Semiconductors 19. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...

Page 20

Philips Semiconductors 24. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

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