tea1501t-n1 NXP Semiconductors, tea1501t-n1 Datasheet
tea1501t-n1
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tea1501t-n1 Summary of contents
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TEA1501 GreenChip SMPS controller IC Rev. 02 — 31 March 2006 1. General description The TEA1501 is the low power member of the GreenChip family and is especially designed for standby Switched Mode Power Supply (SMPS) applications. The TEA1501 incorporates ...
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... Symbol V on/off V data(off) V data(on) I start I DRAIN(off dson V detect 4. Ordering information Table 2. Type number TEA1501T 5. Block diagram SUPPLY CURRENT TRACKING 6 GND MODULATOR 3 BURST BURST OSCILLATOR 2 OOD data on Fig 1. Block diagram TEA1501_2 Product data sheet Quick reference data Parameter Conditions on/off level data off level 20 A < ...
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... Philips Semiconductors 6. Pinning information 6.1 Pinning Fig 2. Pin configuration: TEA1501T (SOT176-1) 6.2 Pin description Table 3. Symbol SOURCE OOD BURST REF AUX GND n.c. DRAIN 7. Functional description The TEA1501 contains a high voltage power switch, a high voltage start-up circuit and low voltage control circuitry on the same IC. Together with a transformer and a few external components a low power, isolated, fl ...
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Philips Semiconductors (1) The secondary earthing point is isolated from the primary earthing points. Fig 3. Basic flyback configuration 7.1 System operation 7.1.1 On/off The system of the TEA1501 can be switched on and off by means of a low ...
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Philips Semiconductors The Burst mode operates by switching at high frequency until V level The TEA1501 stops switching until the time period set by the burst oscillator has expired. At the start of the next burst period ...
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Philips Semiconductors 7.2 Waveforms in the Off mode, Start-up mode and Operation mode V DRAIN V SOURCE V V BURST V OOD Fig 4. Waveforms of the TEA1501 in the Off mode, Start-up mode and Operation mode 7.3 Circuit block ...
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Philips Semiconductors Fig 5. I 7.3.3 Start-up current source The start-up sequence is carried out using an accurate start-up current source. The start-up current flows from the DRAIN pin to the AUX pin via the start-up current source and charges ...
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Philips Semiconductors 7.3.8 Gate driver The gate driver switches the power switch. The power switch is turned on at the beginning of every oscillator cycle and is turned off by the primary current comparator or by the maximum on-time. The ...
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Philips Semiconductors Fig 6. Regulation level AUX as a function of burst duty cycle 7.3.13 Counter The power delivered to the load (auxiliary and secondary function of the number of energy pulses per burst, according to the following ...
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Philips Semiconductors Fig 7. AUX current as a function of counter state 7.4 Design Equations 7.4.1 Primary peak current The primary peak current is determined by the sense resistor R calculated as shown below: R SOURCE 7.4.1.1 Minimum value of ...
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Philips Semiconductors 7.4.3 Leading edge blanking The leading edge blanking time is determined by the reference resistor R below LEB The leading edge blanking time consists of a constant time and a time which tracks with the period ...
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Philips Semiconductors 8. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referred to ground. Positive currents flow into the IC. All pins not mentioned in the voltage list are not allowed ...
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Philips Semiconductors Table 6. Conditions unless otherwise specified < < V Symbol V management AUX V start V th(UVLO) Start-up current source I start I DRAIN(on) I DRAIN(off) Reference block V REF Temperature protection T ...
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Philips Semiconductors Table 6. Conditions unless otherwise specified < < V Symbol Modulator V AUX(max) CP AUX S AUX V offset Supply current tracking I AUX(low) k tracking I AUX(high) 11. Test information 11.1 Quality ...
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Philips Semiconductors 12. Package outline SO8: plastic small outline package; 8 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...
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Philips Semiconductors 13. Soldering 13.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...
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Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...
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Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...
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Philips Semiconductors 14. Revision history Table 8. Revision history Document ID Release date TEA1501_2 20060331 • Modifications: The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors. • Added ...
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Philips Semiconductors 15. Legal information 15.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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Philips Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...