tea1110auh NXP Semiconductors, tea1110auh Datasheet - Page 16

• Manufacturer Part Number: tea1110auh
• Description: Low Voltage Versatile Telephone Transmission Circuit With Dialler Interface
• Manufacturer: NXP Semiconductors

Philips Semiconductors
BONDING PAD LOCATIONS FOR TEA1110AUH
All x/y coordinates represent the position of the centre of the pad (in m) with respect to the origin (x/y = 0/0) of the die
(see Fig.14). The size of all pads is 80 m
2000 Feb 15
handbook, full pagewidth
LN
SLPE
REG
n.c.
DTMF
MUTE
IR
AGC
MIC
MIC+
V
QR
GAR
V
EE
CC
Low voltage versatile telephone
transmission circuit with dialler interface
SYMBOL
x
V CC
0,0
LN
y
GAR
14
13
Fig.14 TEA1110AUH bonding pad locations.
1
SLPE
2
PAD
QR
12
10
11
12
13
14
1
2
3
4
5
6
7
8
9
80 m.
REG
3
V EE
11
n.c.
4
16
MIC
10
DTMF
1449.2
490.2
318.2
5
1174
1450
1449
1297
1108
123
251
685
678
123
123
x
MIC
9
MUTE
8
7
6
COORDINATES
AGC
IR
FCA157
Product specification
TEA1110A
1006.8
1200.2
1017.8
1200
1200
1200
1201
782
459
459
459
459
459
664
y