tda4864j NXP Semiconductors, tda4864j Datasheet
tda4864j
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tda4864j Summary of contents
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... The TDA4864J and TDA4864AJ are deflection boosters for use in vertical deflection systems for frame frequencies up to 200 Hz. The TDA4864J needs a separate flyback supply voltage, so the supply voltages are independently adjustable to optimize power consumption and flyback time. For the TDA4864AJ the flyback supply voltage will be generated internally by doubling the supply voltage and therefore a separate fl ...
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... P2 I VOUT(p-p) T amb 4. Ordering information Table 2: Type number TDA4864J TDA4864AJ 5. Block diagram deflection controller Fig 1. Block diagram (TDA4864J). 9397 750 13441 Product data sheet Quick reference data …continued Parameter Conditions quiescent supply I VOUT current 2 vertical deflection output current (peak-to-peak value) ...
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... INPUT OUTPUT STAGE INP INN VOUT R S1 deflection R P coil R3 from R1 R2 Rev. 01 — 12 August 2004 TDA4864J; TDA4864AJ Vertical deflection booster TDA4864AJ FLYBACK GENERATOR GND © Koninklijke Philips Electronics N.V. 2004. All rights reserved. ...
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... Philips Semiconductors 6. Pinning information 6.1 Pinning Fig 3. Pin configuration (TDA4864J). Fig 4. Pin configuration (TDA4864AJ). 6.2 Pin description Table 3: Symbol GND VOUT INN INP 9397 750 13441 Product data sheet TDA4864J; TDA4864AJ TDA4864J GND ...
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... C the protection will be activated and will reduce the deflection current (I j 7.3 Flyback generator The flyback generator supplies the vertical output stage during flyback. The TDA4864J is used with a separate flyback supply voltage to achieve a short flyback time with minimized power dissipation. The TDA4864AJ needs a capacitor (C Figure 2). Capacitor C R5. During fl ...
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... Philips Semiconductors 8. Internal circuitry Table 4: Pin TDA4864J TDA4864AJ 9397 750 13441 Product data sheet TDA4864J; TDA4864AJ Internal circuitry Symbol Internal circuits V P1 INP GND VOUT INN INP V P1 INP GND VOUT ...
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... To minimize the thermal resistance from mounting base to heatsink [R mounting instruction: screw mounting preferred; torque = 40 Ncm; use heatsink compound; isolation plate increases R 9397 750 13441 Product data sheet TDA4864J; TDA4864AJ Limiting values Parameter Conditions supply voltage 1 supply voltage 2 flyback supply voltage of TDA4864J fl ...
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... Vertical output stage; see Figure 5 I vertical deflection output current VOUT I vertical deflection output current VOUT(p-p) (peak-to-peak value) V output saturation voltage to ground I o(sat)n 9397 750 13441 Product data sheet TDA4864J; TDA4864AJ Conditions Min 1. VOUT during scan - ...
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... Deviation of the output slope at a constant input slope. input signal on pin INN input signal on pin INP output voltage on pin VOUT deflection current through the coil (1) V for TDA4864J; 2V for TDA4864AJ Fig 5. Timing diagram. 9397 750 13441 Product data sheet TDA4864J; TDA4864AJ Conditions I ...
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... Philips Semiconductors 12. Application information TDA4864J Fig 6. Application circuit with TDA4864J for external guard signal generation. DIFFERENTIAL INPUT STAGE 7 INP from deflection controller Attention: the heatsink of the IC must be isolated against ground of the application (it is connected to pin GND). (1) With C (typical value between 47 nF and 150 nF) the flyback time and the noise behavior can be optimized. ...
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... F t and C . flb F (3) R6 reduces the power dissipation of the IC. The maximum possible value depends on the application. Fig 8. Application circuit with TDA4864AJ. 12.1 Example for both TDA4864J and TDA4864AJ Table 8: Values given from application Symbol I defl(max) L deflcoil R defl ...
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... deflcoil ------------------------------ - I defl(max – T j(max) amb = --------------------------------- - – th(j-mb Rev. 01 — 12 August 2004 TDA4864J; TDA4864AJ Vertical deflection booster TDA4864AJ 12.5 12.5 4.4 1.2 3.2 14 105 U’ U’ defl max --------------------- - + V – K/W (max.) © Koninklijke Philips Electronics N.V. 2004. All rights reserved. ...
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... Philips Semiconductors Table 10 flb 350 250 210 Table 11 flb 360 290 240 9397 750 13441 Product data sheet TDA4864J; TDA4864AJ function of V for TDA4864J fl function of V and V fl ( +10 10 +12.5 12.5 +15 15 Rev. 01 — 12 August 2004 Vertical defl ...
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... 14.7 3 12.4 11.4 3.5 2.54 1.27 5.08 14.3 2 11.0 10.0 REFERENCES JEDEC JEITA Rev. 01 — 12 August 2004 TDA4864J; TDA4864AJ Vertical deflection booster view B: mounting base side 6.7 4.5 3.4 1 ...
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... For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. [2] For PMFP packages hot bar soldering or manual soldering is suitable. 9397 750 13441 Product data sheet TDA4864J; TDA4864AJ Suitability of through-hole mount IC packages for dipping and wave soldering methods Rev. 01 — 12 August 2004 Vertical deflection booster stg(max) ...
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... Philips Semiconductors 15. Revision history Table 13: Revision history Document ID Release date TDA4864J_TDA4864AJ_1 20040812 9397 750 13441 Product data sheet TDA4864J; TDA4864AJ Data sheet status Change notice Product data sheet - Rev. 01 — 12 August 2004 Vertical deflection booster Order number Supersedes 9397 750 13441 - © ...
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... For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com 9397 750 13441 Product data sheet TDA4864J; TDA4864AJ [2] [3] Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. ...
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... Flyback generator . . . . . . . . . . . . . . . . . . . . . . . 5 8 Internal circuitry Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8 12 Application information 12.1 Example for both TDA4864J and TDA4864AJ 11 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 14 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 14.1 Introduction to soldering through-hole mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 14.2 Soldering by dipping or by solder wave . . . . . 15 14.3 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 15 14.4 Package related soldering information . . . . . . 15 15 Revision history ...