tza3010b NXP Semiconductors, tza3010b Datasheet - Page 16

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tza3010b

Manufacturer Part Number
tza3010b
Description
Tza3010b 30 Mbits/s Up To 3.2 Gbits/s A-rate Tm Laser Driver
Manufacturer
NXP Semiconductors
Datasheet
Philips Semiconductors
13 PACKAGE OUTLINE
2003 Apr 07
HBCC32: plastic thermal enhanced bottom chip carrier; 32 terminals; body 5 x 5 x 0.65 mm
30 Mbits/s up to 3.2 Gbits/s
A-rate
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
OUTLINE
SOT560-1
max.
0.8
A
ball A1
index area
0.10
0.05
A
laser driver
1
e 2
C
B
1
0.7
0.6
A
2
0.35
0.20
IEC
b
32
0.5
0.3
b 1
e
D 1
e 1
e 3
0.50
0.35
D
b 2
MO-217
JEDEC
0.50
0.35
b 3
0
REFERENCES
5.1
4.9
D
3.2
3.0
D 1
E 1
E
X
scale
JEITA
2.5
16
x C
e 4
5.1
4.9
x B
E
3.2
3.0
E 1
0.5
e
5 mm
4.2
e 1
v A
detail X
4.2
e 2
b 2
b 1
A 2
A
4.15
e 3
PROJECTION
EUROPEAN
A 1
4.15
e 4
A
w
b
w
v
v
y
b 3
M
M
M
M
0.2
C
C
C
C
v
w
v
Product specification
A
A
M
M
TZA3010B
w
v
0.15
B
B
w
C
C
M
M
ISSUE DATE
00-02-01
03-03-12
A
C
C
0.15
B
A
x
SOT560-1
B
0.05
y

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