tda3661at-n1 NXP Semiconductors, tda3661at-n1 Datasheet
tda3661at-n1
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tda3661at-n1 Summary of contents
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TDA3661 Very low dropout voltage/quiescent current adjustable voltage regulator Rev. 05 — 28 June 2005 1. General description The TDA3661 is an adjustable voltage regulator with very low dropout voltage and quiescent current, which operates over a wide supply voltage ...
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... Philips Semiconductors 4. Ordering information Table 2: Type number TDA3661AT 5. Block diagram Fig 1. Block diagram 6. Pinning information 6.1 Pinning Fig 2. Pin configuration 9397 750 15049 Product data sheet Very low dropout voltage/quiescent current voltage regulator Ordering information Package Name Description SO8 plastic small outline package; 8 leads; ...
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Philips Semiconductors 6.2 Pin description Table 3: Symbol REG GND n.c. ADJ V P [1] All GND pins are connected to the lead frame and can also be used to reduce the total thermal resistance R th(j-a) board acts like ...
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Philips Semiconductors 10. Characteristics Table 6: Characteristics 4.01929 P amb Symbol Parameter Supply voltage: pin supply voltage P I quiescent supply current q Regulator output: pin REG ...
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Philips Semiconductors 11.2 Stability The regulator is stabilized with an external capacitor connected to the output. For stable operation: 1. The output capacitor ESR should not exceed maximum ESR may be required; see recommended ...
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... TDA3661. The application circuit is given in Fig 4. Application circuit with enable function 11.4 Additional application information This section gives typical curves for various parameters measured on the TDA3661AT. Standard test conditions are: V 9397 750 15049 Product data sheet ...
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Philips Semiconductors mA. REG Fig 5. Quiescent current as a function of the supply voltage 2 I (1) q (mA) 1.5 1 0.5 (2) 0 ...
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Philips Semiconductors (mA) 1.8 1.6 1 mA. REG Fig 9. Quiescent current as a function of the supply voltage 6 V REG ( 100 I ...
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Philips Semiconductors 6 V REG ( 100 and pulsed load P Fig 13. Fold back protection mode 12. Test information 12.1 Quality information The General Quality Specification for Integrated Circuits, SNW-FQ-611 is ...
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Philips Semiconductors 13. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...
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Philips Semiconductors 14. Soldering 14.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...
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Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...
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Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...
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Philips Semiconductors 15. Revision history Table 10: Revision history Document ID Release date TDA3661_5 20050628 • Modifications: The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors. • Paragraph ...
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Philips Semiconductors 16. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
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Philips Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...