mc9s08se4 Freescale Semiconductor, Inc, mc9s08se4 Datasheet - Page 2

• Manufacturer Part Number: mc9s08se4
• Description: 8-bit Hcs08 Central Processor Unit
• Manufacturer: Freescale Semiconductor, Inc

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Revision History
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be the most current. Your printed copy may be an earlier revision. To verify you have the latest information
available, refer to:
The following revision history table summarizes changes contained in this document.
Related Documentation
Find the most current versions of all documents at: http://www.freescale.com
2
Reference Manual
1
2
Revision
MCU Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
3.1
3.2
3.3
3.4
3.5
3.6
3.7
http://freescale.com/
Parameter Classification . . . . . . . . . . . . . . . . . . . . . . . . .6
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . .6
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .7
ESD Protection and Latch-Up Immunity . . . . . . . . . . . . .8
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Supply Current Characteristics . . . . . . . . . . . . . . . . . . .14
External Oscillator (XOSC) Characteristics . . . . . . . . .18
10/8/2008
1/16/2009
Date
(MC9S08SE8RM)
Contains extensive product information including modes of operation, memory,
resets and interrupts, register definition, port pins, CPU, and all module
information.
Initial public released.
In
S3I
Table
DD
in 0–85 °C; changed the typical of S2I
MC9S08SE8 Series MCU Data Sheet, Rev. 2
8, added the Max. of S2I
Table of Contents
4
DD
Description of Changes
3.8
3.9
3.10 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.11 Flash Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.1
4.2
and S3I
Internal Clock Source (ICS) Characteristics . . . . . . . . 19
ADC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.10.1 Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.10.2 TPM/MTIM Module Timing . . . . . . . . . . . . . . . . 24
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Mechanical Drawings. . . . . . . . . . . . . . . . . . . . . . . . . . 26
DD
DD
in 0–105 °C; changed the Max. of S2I
and S3I
DD
; changed the S23I
Freescale Semiconductor
DDRTI
to P.
DD
and