74LVC1G14GW,125 NXP Semiconductors, 74LVC1G14GW,125 Datasheet
74LVC1G14GW,125
Specifications of 74LVC1G14GW,125
74LVC1G14GW-G
935268595125
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74LVC1G14GW,125 Summary of contents
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Single Schmitt-trigger inverter Rev. 8 — 10 November 2010 1. General description The 74LVC1G14 provides the inverting buffer function with Schmitt-trigger action. The input can be driven from either 3 devices. This feature allows the ...
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... NXP Semiconductors 4. Ordering information Table 1. Ordering information Type number Package Temperature range Name −40 °C to +125 °C 74LVC1G14GW −40 °C to +125 °C 74LVC1G14GV −40 °C to +125 °C 74LVC1G14GM −40 °C to +125 °C 74LVC1G14GF −40 °C to +125 °C 74LVC1G14GN −40 °C to +125 °C 74LVC1G14GS 5 ...
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... NXP Semiconductors 7. Pinning information 7.1 Pinning 74LVC1G14 n. GND 001aab655 Fig 4. Pin configuration SOT353-1 and SOT753 7.2 Pin description Table 3. Pin description Symbol Pin SOT353-1, SOT753 n. GND n. Functional description [1] Table 4. Function table Input [ HIGH voltage level LOW voltage level 74LVC1G14 Product data sheet ...
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... NXP Semiconductors 9. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC V input voltage I V output voltage O I input clamping current IK I output clamping current OK I output current ...
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... NXP Semiconductors 11. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions V HIGH-level output voltage = −100 μ −4 mA −8 mA −12 mA −24 mA −32 mA LOW-level output voltage = 100 μ input leakage GND current ...
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... NXP Semiconductors Table 8. Transfer characteristics Voltages are referenced to GND (ground = 0 V); for load circuit see Symbol Parameter Conditions V negative-going see T− threshold voltage hysteresis voltage ( Figure [1] All typical values are measured at T 12. Dynamic characteristics Table 9. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for load circuit see ...
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... NXP Semiconductors 13. Waveforms Measurement points are given in V and V are typical output voltage levels that occur with the output load Fig 7. The data input (A) to output (Y) propagation delays Table 10. Measurement points Supply voltage 1. 2.7 V 2 3 5.5 V ...
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... NXP Semiconductors Table 11. Test data Supply voltage Input 2.7 V 2 3.6 V 2 14. Waveforms transfer characteristics T− Fig 9. Transfer characteristic Fig 11. Typical transfer characteristics 74LVC1G14 Product data sheet Load ≤ 2 ≤ 2 ≤ 2 ≤ 2 ≤ 2 mna207 Fig 10. Definition of V ...
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... NXP Semiconductors 15. Application information The slow input rise and fall times cause additional power dissipation, this can be calculated using the following formula add P = additional power dissipation (μW); add f = input frequency (MHz input rise time (ns input fall time (ns ΔI CC(AV) Average ΔI ...
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... NXP Semiconductors 16. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1. DIMENSIONS (mm are the original dimensions UNIT max. 0.1 1.0 mm 1.1 0.15 0 0.8 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION IEC SOT353-1 Fig 14 ...
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... NXP Semiconductors Plastic surface-mounted package; 5 leads DIMENSIONS (mm are the original dimensions) UNIT 0.100 1.1 0.40 0.26 mm 0.013 0.9 0.25 0.10 OUTLINE VERSION IEC SOT753 Fig 15. Package outline SOT753 (SC-74A) 74LVC1G14 Product data sheet scale 3.1 1.7 3.0 0.6 0.95 2.7 1.3 2 ...
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... NXP Semiconductors XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1. 6× (2) terminal 1 index area DIMENSIONS (mm are the original dimensions) ( UNIT b D max max 0.25 1.5 mm 0.5 0.04 0.17 1.4 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. ...
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... NXP Semiconductors XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 0 6× (1) terminal 1 index area DIMENSIONS (mm are the original dimensions UNIT b D max max 0.20 1.05 mm 0.5 0.04 0.12 0.95 Note 1. Can be visible in some manufacturing processes. OUTLINE VERSION IEC SOT891 Fig 17 ...
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... NXP Semiconductors XSON6: extremely thin small outline package; no leads; 6 terminals; body 0.9 x 1 (6×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 0.95 mm nom 0.15 0.90 min 0.12 0.85 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. ...
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... NXP Semiconductors XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1 (6×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 1.05 mm nom 0.15 1.00 min 0.12 0.95 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. ...
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... NXP Semiconductors 17. Abbreviations Table 12. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor TTL Transistor-Transistor Logic HBM Human Body Model ESD ElectroStatic Discharge MM Machine Model DUT Device Under Test 18. Revision history Table 13. Revision history Document ID Release date 74LVC1G14 v.8 20101110 • Modifications: Added type number 74LVC1G14GN (SOT1115 / XSON6 package). • ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 20. Contact information For more information, please visit: For sales office addresses, please send an email to: 74LVC1G14 Product data sheet 19 ...
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... NXP Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Functional description . . . . . . . . . . . . . . . . . . . 3 9 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 13 Waveforms ...