74HC1G08GW,125 NXP Semiconductors, 74HC1G08GW,125 Datasheet
74HC1G08GW,125
Specifications of 74HC1G08GW,125
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74HC1G08GW,125 Summary of contents
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AND gate Rev. 04 — 17 July 2007 1. General description 74HC1G08 and 74HCT1G08 are high-speed, Si-gate CMOS devices. They provide a 2-input AND function. The HC device has CMOS input switching levels and supply voltage range ...
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... NXP Semiconductors 5. Functional diagram Fig 1. Logic symbol Fig 3. Logic diagram 6. Pinning information 6.1 Pinning Fig 4. Pin configuration 6.2 Pin description Table 3. Pin description Symbol Pin GND 74HC_HCT1G08_4 Product data sheet 4 Y mna113 Fig 2. IEC logic symbol B A 74HC1G08 74HCT1G08 GND ...
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... NXP Semiconductors 7. Functional description Table 4. Function table H = HIGH voltage level LOW voltage level Input Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC I input clamping current ...
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... NXP Semiconductors 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). All typical values are measured at T Symbol Parameter For type 74HC1G08 V HIGH-level input IH voltage V LOW-level input IL voltage V HIGH-level output OH voltage V LOW-level output OL voltage I input leakage current I I supply current ...
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... NXP Semiconductors Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). All typical values are measured at T Symbol Parameter I supply current CC I additional supply CC current C input capacitance I 11. Dynamic characteristics Table 8. Dynamic characteristics GND = 6.0 ns; All typical values are measured Symbol Parameter ...
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... NXP Semiconductors 12. Waveforms input M t PHL Y output V M For 74HC1G08 0.5 M For 74HCT1G08 1 Fig 5. The input (A and B) to output (Y) propagation delays 74HC_HCT1G08_4 Product data sheet t PLH mna116 GND GND to 3 Fig 6. Load circuitry for switching times Rev. 04 — 17 July 2007 74HC1G08; 74HCT1G08 ...
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... NXP Semiconductors 13. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1. DIMENSIONS (mm are the original dimensions UNIT max. 0.1 1.0 mm 1.1 0.15 0 0.8 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION IEC SOT353-1 Fig 7 ...
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... NXP Semiconductors Plastic surface-mounted package; 5 leads DIMENSIONS (mm are the original dimensions UNIT 0.100 0.40 1.1 0.26 mm 0.013 0.25 0.9 0.10 OUTLINE VERSION IEC SOT753 Fig 8. Package outline SOT753 (SC-74A) 74HC_HCT1G08_4 Product data sheet scale 3.1 1.7 3.0 0.6 0.95 2.7 1.3 2 ...
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... Release date 74HC_HCT1G08_4 20070717 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Package SOT353 changed to SOT353-1 in • ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 14 Abbreviations ...