sigc15t60s Infineon Technologies Corporation, sigc15t60s Datasheet
sigc15t60s
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sigc15t60s Summary of contents
Page 1
... Ni Ag –system suitable for epoxy and soft solder die bonding electrically conductive glue or solder store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C SIGC15T60S Package Ordering Code Q67050- sawn on foil A4393-A101 mm ...
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... Symbol Conditions 30A , SIGC15T60S Value 600 -40 ... +175 Value min. typ. max. = 2mA 600 C =30A 1.5 2. 4.1 4.9 5 =0V 1 ...
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... CHIP DRAWING: Edited by INFINEON Technologies CLS, L7551D, Edition 2, 26.01.2005 SIGC15T60S ...
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... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies CLS, L7551D, Edition 2, 26.01.2005 SIGC15T60S IKW30N60T ...