std1nb60 STMicroelectronics, std1nb60 Datasheet

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std1nb60

Manufacturer Part Number
std1nb60
Description
N - Channel 600v - 7.4ohm - 1a - Ipak/dpak Powermesh Mosfet
Manufacturer
STMicroelectronics
Datasheet

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DESCRIPTION
Using the latest high voltage MESH OVERLAY
process, STMicroelectronics has designed an
advanced family of power MOSFETs with
outstanding performances. The new patent
pending strip layout coupled with the Company’s
proprietary edge termination structure, gives the
lowest R
and dv/dt capabilities and unrivalled gate charge
and switching characteristics.
APPLICATIONS
ABSOLUTE MAXIMUM RATINGS
( ) Pulse width limited by safe operating area
November 1999
STD1NB60
Symbol
dv/dt(
TYPICAL R
EXTREMELY HIGH dv/dt CAPABILITY
100% AVALANCHE TESTED
VERY LOW INTRINSIC CAPACITANCES
GATE CHARGE MINIMIZED
SWITCH MODE POWER SUPPLIES (SMPS)
DC-AC CONVERTERS FOR WELDING
EQUIPMENT AND UNINTERRUPTIBLE
POWER SUPPLIES AND MOTOR DRIVE
I
V
DM
V
V
T
P
DGR
I
I
T
GS
stg
DS
D
D
tot
TYPE
( )
j
1
)
DS(on)
Drain-source Voltage (V
Drain- gate Voltage (R
Gate-source Voltage
Drain Current (continuous) at T
Drain Current (continuous) at T
Drain Current (pulsed)
Total Dissipation at T
Derating Factor
Peak Diode Recovery voltage slope
Storage Temperature
Max. Operating Junction Temperature
®
DS(on)
per area, exceptional avalanche
600 V
V
= 7.4
DSS
N - CHANNEL 600V - 7.4 - 1A - IPAK/DPAK
< 8.5
R
DS(on)
c
Parameter
GS
= 25
GS
= 20 k )
= 0)
o
C
c
c
1 A
= 25
= 100
I
D
o
C
o
C
(
1
) I
SD
PowerMESH
INTERNAL SCHEMATIC DIAGRAM
(Suffix "-1")
di/dt â 200 A/ s, V
TO-251
IPAK
-65 to 150
1
Value
DD
0.63
0.36
600
600
150
3.5
2
45
1
4
30
3
V
STD1NB60
(BR)DSS
PRELIMINARY DATA
, Tj
MOSFET
(Suffix "T4")
TO-252
DPAK
T
JMAX
1
W/
V/ns
Unit
o
o
3
W
V
V
V
A
A
A
C
C
o
C
1/6

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std1nb60 Summary of contents

Page 1

... A TO-251 (Suffix "-1") INTERNAL SCHEMATIC DIAGRAM = 100 di/dt â 200 STD1NB60 MOSFET PRELIMINARY DATA IPAK DPAK TO-252 (Suffix "T4") Value Unit 600 600 0.36 W/ 3.5 V/ns -65 to 150 ...

Page 2

... STD1NB60 THERMAL DATA R Thermal Resistance Junction-case thj-case Thermal Resistance Junction-ambient Rthj-amb R Thermal Resistance Case-sink thc-sink T Maximum Lead Temperature For Soldering Purpose l AVALANCHE CHARACTERISTICS Symbol I Avalanche Current, Repetitive or Not-Repetitive AR (pulse width limited Single Pulse Avalanche Energy AS o (starting ELECTRICAL CHARACTERISTICS (T ...

Page 3

... 4 Test Conditions di/dt = 100 100 150 STD1NB60 Min. Typ. Max. Unit 3.5 nC Min. Typ. Max. Unit Min. Typ. Max. Unit ...

Page 4

... STD1NB60 TO-251 (IPAK) MECHANICAL DATA DIM. MIN. A 2.2 A1 0.9 A3 0.7 B 0. 0. 6.4 G 4 4/6 mm TYP. MAX. MIN. 2.4 0.086 1.1 0.035 1.3 0.027 0.9 0.025 5.4 0.204 0.85 0.3 0.95 0.6 0.017 0.6 0.019 6.2 0.236 6.6 0.252 4.6 0.173 16.3 0.626 9.4 0.354 1.2 0.031 0 inch TYP. MAX. 0.094 0.043 0.051 ...

Page 5

... H 9.35 L2 0.8 L4 0.6 H DETAIL "A" inch MAX. MIN. TYP. 2.4 0.086 1.1 0.035 0.23 0.001 0.9 0.025 5.4 0.204 0.6 0.017 0.6 0.019 6.2 0.236 6.6 0.252 4.6 0.173 10.1 0.368 0.031 1 0.023 DETAIL "A" STD1NB60 MAX. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.260 0.181 0.397 0.039 0068772-B 5/6 ...

Page 6

... STD1NB60 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice ...

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