lis3l02ds STMicroelectronics, lis3l02ds Datasheet

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lis3l02ds

Manufacturer Part Number
lis3l02ds
Description
Three Axis 2g-6g Linear Accelerometer
Manufacturer
STMicroelectronics
Datasheet
BLOCK DIAGRAM
DESCRIPTION
The LIS3L02DS is a tri-axis digital output linear ac-
celerometer that includes a sensing element and
an IC interface able to take the information from
the sensing element and to provide the measured
acceleration signals to the external world through
an I2C/SPI serial interface.
The sensing element, capable to detect the accel-
eration, is manufactured using a dedicated pro-
cess called THELMA (Thick Epi-Poly Layer for
Microactuators and Accelerometers) developed
by ST to produce inertial sensors and actuators in
silicon.
The IC interface instead is manufactured using a
CMOS process that allows high level of integration
to design a dedicated circuit which is factory
trimmed to better match the sensing element char-
acteristics.
The LIS3L02DS has a user selectable full scale of
2g, 6g and it is capable of measuring accelerations
February 2004
This is preliminary information on a new product now in development. Details are subject to change without notice.
2.7V TO 3.6V SINGLE SUPPLY OPERATION
I2C/SPI DIGITAL OUTPUT INTERFACES
MOTION ACTIVATED INTERRUPT SOURCE
FACTORY TRIMMED DEVICE SENSITIVITY
AND OFFSET
EMBEDDED SELF TEST
HIGH SHOCK SURVIVABILITY
3Axis - 2g/6g DIGITAL OUTPUT LINEAR ACCELEROMETER
rot
VOLTAGE, CURRENT
S1X
S1Y
S1Z
S2Z
S2Y
S2X
REFERENCE
MUX
AMPLIFIER
CHARGE
TRIMMING CIRCUIT
TEST INTERFACE
&
MUX
DE
over a maximum bandwidth of 2.0 KHz for the X,
Y axis and Z axis. The device bandwidth may be
programmed accordingly to the application re-
quirements. A self-test capability allows the user to
check the functioning of the system.
The device may be configured to generate an iner-
tial wake-up/interrupt signal when a programma-
ble acceleration threshold is exceeded along one
of the three axis.
The LIS3L02DS is available in plastic SMD pack-
age and it is specified over a temperature range
extending from -40°C to +85°C.
The LIS3L02DS belongs to a family of products
suitable for a variety of applications:
Σ∆
Σ∆
Σ∆
– Antitheft systems and Inertial navigation
– Virtual reality input devices
– Vibration Monitoring, recording and compen-
– Robotics and Appliance control
PHASE GENERATOR
sation
CLOCK
ORDERING NUMBER: LIS3L02DS
Reconstruction
Reconstruction
Reconstruction
&
Filter
Filter
Filter
INERTIAL SENSOR:
SO-24
INTERRUPT GEN.
CONTROL LOGIC
Regs
Array
LIS3L02DS
&
PRODUCT PREVIEW
SPI
I2C
CS
SCL/SPC
SDA/SDIO
SDO
RDY/INT
1/18

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lis3l02ds Summary of contents

Page 1

... EMBEDDED SELF TEST ■ HIGH SHOCK SURVIVABILITY DESCRIPTION The LIS3L02DS is a tri-axis digital output linear ac- celerometer that includes a sensing element and an IC interface able to take the information from the sensing element and to provide the measured acceleration signals to the external world through an I2C/SPI serial interface ...

Page 2

... LIS3L02DS PIN DESCRIPTION N° Pin Internally not connected 6 GND 0V supply 7 Vdd Power supply 8 RDY/INT Data ready/inertial wake-up interrupt 9 SDO SPI Serial Data Output 10 SDA/ I2C Serial Data (SDA) SDI/ SPI Serial Data Input (SDI) SDO 3-wire Interface Serial Data Output (SDO) ...

Page 3

... T = 25°C Full-scale = 2g BW=56Hz T = 25°C -50 Full-scale = 2g Best fit straight line X, Y axis Full-scale = 2g BW=56Hz Best fit straight line Z axis Full-scale = 2g BW=56Hz Dec factor = 128 Dec factor = 64 Dec factor = 32 Dec factor = 8 LIS3L02DS 1 Max. Unit Typ. 3 1.5 mA µ 1150 Hz ±2.0 g ±6.0 ...

Page 4

... LIS3L02DS ABSOLUTE MAXIMUM RATING Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. ...

Page 5

... Figure 1. Equivalent electrical circuit C R ps1 s1 S1x C s1x s2x S2x C R ps2 ps1 s1 S1y C s1y s2y S2y C R ps2 ps1 s1 S1z C s1z s2z S2z C R ps2 s2 LIS3L02DS rot 5/18 ...

Page 6

... The acceleration data may be accessed through an I2C/SPI interface thus making the device particularly suitable for direct interfacing with a microcontroller. The LIS3L02DS features a Data-Ready signal (DRY) which indicated when a new set of measured accel- eration data is available thus simplifying data synchronization in digital system employing the device itself. ...

Page 7

... Interface Serial Data Output (SDO) SDO SPI Serial Data Output (SDO) 2.1 I2C Serial Interface The LIS3L02DS I2C is a bus slave. The I2C is employed to write the data into the registers whose content can also be read back. 2 The relevant I C terminology is given in the table below Table 2 ...

Page 8

... LIS3L02DS knowledge pulse. The receiver must then pull the data line LOW so that it remains stable low during the HIGH period of the acknowledge clock pulse. A receiver which has been addressed is obliged to generate an acknowledge after each byte of data has been received. 2 The I C embedded inside the Gengine ASIC behaves like a slave device and the following protocol must be adhered to ...

Page 9

... DI(7:0) (write mode). This is the data that will be written into the device (MSb first). – bit 8-15: data DO(7:0) (read mode). This is the data that will be read from the device (MSb first). DI7 DI6 DI5 DI4 DI3 DI2 DI1 DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0 LIS3L02DS DI0 9/18 ...

Page 10

... LIS3L02DS 2.2.2 SPI Read Figure 3. SPI Read protocol CS SPC SPDI RW AD6 AD5 AD4 AD3 AD2 AD1 AD0 SPDO The SPI Read command consists is performed with 16 clocks pulses: – bit 0: READ bit. The value is 1. – bit 1-7: address AD(6:0). This is the address field of the indexed register. ...

Page 11

... LIS3L02DS Size Comment (Bit) Reserved 8 Loaded at boot 8 Loaded at boot 8 Loaded at boot 8 Loaded at boot 8 Loaded at boot 8 Loaded at boot Reserved 8 8 Reserved Reserved ...

Page 12

... LIS3L02DS 4 REGISTERS DESCRIPTION The device contains a set of registers which are used to control its behavior and to retrieve acceleration data. 4.1 OFFSET_X (16h) OX7 OX7, OX0 Digital Offset Trimming for X-Axis 4.2 OFFSET_Y (17h) OY7 DOY7, DOY0 Digital Offset Trimming for Y-Axis 4.3 OFFSET_Z (18h) OZ7 ...

Page 13

... RDY pad; 1: int req on RDY pad) DRDY Enable Data-Ready generation SIM SPI Serial Interface Mode selection (0: 4-wire interface; 1: 3-wire interface) DAS Data Alignement Selection (0: 12 bit right justified bit left justified) PD0 DF1 DF0 ST x BOOT IEN LIS3L02DS Zen Yen Xen DRDY SIM DAS 13/18 ...

Page 14

... LIS3L02DS 4.9 WAKE_UP_CFG (23h) x LIR Latch interrupt request (1: interrupt request latched) MZH Mask Z High Interrupt (1: enable int req on measured accel. value higher than preset threshold) MZL Mask Z Low Interrupt (1: enable int req on measured accel. value lower than preset threshold) MYH Mask Y High Interrupt (1: enable int req on measured accel ...

Page 15

... X axis acceleration data MSb 4.15 OUTY_L (2Ah) YD7 YD7, YD0 Y axis acceleration data LSb ZOR YOR XOR ZYXDA XD6 XD5 XD4 XD3 . XD13 XD12 XD11 YD6 YD5 YD4 YD3 LIS3L02DS ZDA YDA XDA XD2 XD1 XD0 XD10 XD9 XD8 YD2 YD1 YD0 15/18 ...

Page 16

... LIS3L02DS 4.16 OUTY_H (2Bh) When reading the register in “12 bit right justified” mode the most significant bits (7:4) are replaced with bit 3 (i.e. YD15- YD12=YD11, YD11, YD11, YD11) YD15 YD14 YD15, YD8 Y axis acceleration data MSb 4.17 OUTZ_L (2Ch) ZD7 ZD7, ZD0 Z axis acceleration data LSb 4.18 OUTZ_H (2Dh) When reading the register in “ ...

Page 17

... H 10.0 10.65 0.394 h 0.25 0.75 0.010 k 0˚ (min.), 8˚ (max.) L 0.40 1.27 0.016 B 0.10mm .004 Seating Plane inch MECHANICAL DATA TYP. MAX. 0.104 0.012 0.100 0.0200 0.013 0.614 0.299 0,050 0.419 0.030 0.050 LIS3L02DS OUTLINE AND SO24 h x 45˚ SO24 17/18 ...

Page 18

... LIS3L02DS Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice ...

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