k6f2016v4e Samsung Semiconductor, Inc., k6f2016v4e Datasheet - Page 4

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k6f2016v4e

Manufacturer Part Number
k6f2016v4e
Description
128k X16 Bit Super Low Power And Low Voltage Full Cmos Static Ram
Manufacturer
Samsung Semiconductor, Inc.
Datasheet
K6F2016V4E Family
RECOMMENDED DC OPERATING CONDITIONS
Note:
1. T
2. Overshoot: Vcc+2.0V in case of pulse width 20ns.
3. Undershoot: -2.0V in case of pulse width 20ns.
4. Overshoot and undershoot are sampled, not 100% tested.
CAPACITANCE
1. Capacitance is sampled, not 100% tested.
DC AND OPERATING CHARACTERISTICS
1. Typical values are measured at V
Input leakage current
Output leakage current
Average operating current
Output low voltage
Output high voltage
Standby Current (CMOS)
Supply voltage
Ground
Input high voltage
Input low voltage
Input capacitance
Input/Output capacitance
A
=-40 to 85 C, otherwise specified.
Item
Item
1)
Item
(f=1MHz, T
CC
=3.3V, T
Symbol
A
I
I
V
V
I
I
=25 C)
CC1
CC2
SB1
I
LO
LI
OH
OL
A
=25 C and not 100% tested.
Symbol
V
CS=V
Cycle time=1 s, 100%duty, I
LB 0.2V or/and UB 0.2V, V
Cycle time=Min, I
LB=V
I
I
Other input =0~Vcc
C
C
OL
OH
1) CS Vcc-0.2V(CS controlled) or
2) LB=UB Vcc-0.2V, CS 0.2V(LB/UB controlled)
IN
IN
IO
=Vss to Vcc
= 2.1mA
= -1.0mA
IL
IH
or/and UB=V
or OE=V
Symbol
Vcc
Vss
V
V
IH
IO
Test Condition
IH
IL
=0mA, 100% duty, CS=V
or WE=V
Test Conditions
IL
V
V
, V
- 4 -
IN
IO
IN
=0V
=0V
1)
=V
IN
IL
IO
IL
, V
=0mA, CS 0.2V,
0.2V or V
or V
IO
=Vss to Vcc
-0.2
IH
Min
3.0
2.2
0
3)
IN
V
IL
CC
,
Min
-0.2V
-
-
Typ
3.3
0
-
-
Min
2.4
-1
-1
Vcc+0.2
CMOS SRAM
-
-
-
-
Max
10
8
Max
3.6
0.6
0
Typ
0.5
-
-
-
-
-
-
2)
1)
Revision 1.0
Max
0.4
March 2002
40
10
1
1
4
-
Unit
Unit
pF
pF
V
V
V
V
Unit
mA
mA
V
V
A
A
A

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