TS4962EKIJT STMICROELECTRONICS [STMicroelectronics], TS4962EKIJT Datasheet - Page 21

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TS4962EKIJT

Manufacturer Part Number
TS4962EKIJT
Description
3W Filter-free Class D Audio Power Amplifier
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
Package Mechanical Data
4 Package Mechanical Data
4.1 Pin-out and markings for 9-bump flip-chip
Figure 61. Pin-out for
Figure 62. Marking for
4.2 Mechanical data for 9-bump flip-chip
0.5mm
0.5mm
4/B1
4/B1
1/A1
1/A1
V
V
1.60 mm
1.60 mm
0.5mm
0.5mm
7/C1
7/C1
IN
IN
IN
IN
A62
A62
DD
DD
YWW
YWW
+
+
-
-
9-bump flip-chip
9-bump flip-chip
GND
GND
STBY
STBY
2/A2
2/A2
V
V
5/B2
5/B2
8/C2
8/C2
DD
DD
E
E
∅ 0.25mm
∅ 0.25mm
600µm
600µm
1.60 mm
1.60 mm
OUT
OUT
OUT
OUT
GND
GND
3/A3
3/A3
6/B3
6/B3
9/C3
9/C3
100µm
100µm
Marking: A62
(top view)
(top view)
-
-
+
+
ST Logo
Part Number: A62
Three digits Datecode: YWW
E symbol for lead-free only
The dot is for marking pin A1
■ Bumps are underneath
■ Bump diameter = 300µm
■ Die size: 1.6mm x 1.6mm ±30µm
■ Die height (including bumps): 600µm
■ Bump diameter: 315µm ±50µm
■ Bump diameter before Reflew: 300µm ±10µm
■ Bump height: 250µm ±40µm
■ Die Height: 350µm ±20µm
■ Pitch: 500µm ±50µm
■ *Back Coating layer Height: 100µm ±10µm
■ Coplanarity: 60µm max
* Optional
TS4962
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