TS4962M_07 STMICROELECTRONICS [STMicroelectronics], TS4962M_07 Datasheet - Page 38

• Manufacturer Part Number: TS4962M_07
• Description: 3W filter-free class D audio power amplifier
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Package information
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Package information
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
Figure 72. Pin-out for 9-bump flip-chip (top view)
Figure 73. Marking for 9-bump flip-chip (top view)
Figure 74. Mechanical data for 9-bump flip-chip
0.5mm
0.5mm
®
XXX
XXX
packages. These packages have a lead-free second level interconnect. The
YWW
YWW
0.5mm
0.5mm
1.60 mm
1.60 mm
4/B1
4/B1
1/A1
1/A1
V
V
7/C1
7/C1
IN
IN
IN
IN
DD
DD
+
+
-
-
∅ 0.25mm
∅ 0.25mm
E
E
600µm
600µm
GND
GND
STBY
STBY
1.60 mm
1.60 mm
2/A2
2/A2
V
V
5/B2
5/B2
8/C2
8/C2
DD
DD
■
■
■
■
■
■
■
■
■
■
■
■
■
■
OUT
OUT
GND
GND
OUT
OUT
3/A3
3/A3
6/B3
6/B3
ST Logo
Symbol for lead-free: E
Two first XX product code: 62
third X: Assembly code
Three digits date code: Y for year - WW for week
The dot is for marking pin A1
9/C3
9/C3
-
-
+
+
Die size: 1.6mm x 1.6mm ±30μm
Die height (including bumps): 600μm
Bump diameter: 315μm ±50μm
Bump diameter before reflow: 300μm ±10μm
Bump height: 250μm ±40μm
Die height: 350μm ±20μm
Pitch: 500μm ±50μm
Coplanarity: 50μm max
■
■
Bumps are underneath
Bump diameter = 300μm
TS4962M