S25FL016A0LMAI000

Manufacturer Part NumberS25FL016A0LMAI000
Description16 Megabit CMOS 3.0 Volt Flash Memory with 50MHz SPI (Serial Peripheral Interface) Bus
ManufacturerSPANSION [SPANSION]
S25FL016A0LMAI000 datasheet
 


1
Page 1
2
Page 2
3
Page 3
4
Page 4
5
Page 5
6
Page 6
7
Page 7
8
Page 8
9
Page 9
10
Page 10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
Page 1/34

Download datasheet (998Kb)Embed
Next
S25FL016A
16 Megabit CMOS 3.0 Volt Flash Memory
with 50MHz SPI (Serial Peripheral Interface) Bus
Data Sheet (Preliminary)
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Publication Number S25FL016A_00
Notice On Data Sheet Designations
Revision C0
Issue Date August 28, 2006
S25FL016A Cover Sheet
for definitions.

S25FL016A0LMAI000 Summary of contents

  • Page 1

    S25FL016A 16 Megabit CMOS 3.0 Volt Flash Memory with 50MHz SPI (Serial Peripheral Interface) Bus Data Sheet (Preliminary) Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein. Each product described herein may be ...

  • Page 2

    Notice On Data Sheet Designations Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of product information or intended specifications throughout the product life cycle, including development, qualification, initial production, and full production. In all ...

  • Page 3

    S25FL016A 16 Megabit CMOS 3.0 Volt Flash Memory with 50MHz SPI (Serial Peripheral Interface) Bus Data Sheet (Preliminary) Distinctive Characteristics Architectural Advantages Single power supply operation – Full voltage range: 2.7 to 3.6 V read and program operations Memory Architecture ...

  • Page 4

    General Description The S25FL016A is a 3.0 Volt (2 3.6 V), single-power-supply Flash memory device. The device consists of thirty-two sectors, each with 512 Kb memory. The device accepts data written to SI (Serial Input) and outputs data ...

  • Page 5

    Table of Contents Distinctive Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

  • Page 6

    List of Figures Figure 2.1 16-pin Plastic Small Outline Package (SO ...

  • Page 7

    Block Diagram SRAM Logic August 28, 2006 S25FL016A_00_C0 Array - L RD DATA PATH IO S25FL016A PS ...

  • Page 8

    Connection Diagrams Figure 2.1 16-pin Plastic Small Outline Package (SO) 16 HOLD VCC ...

  • Page 9

    Input/Output Descriptions Signal Name I/O SO (Signal Data Output) Output SI (Serial Data Input) Input SCK (Serial Clock) Input CS# (Chip Select) Input HOLD# (Hold) Input W# (Write Protect) Input V Input CC GND Input ...

  • Page 10

    Ordering Information The ordering part number is formed by a valid combination of the following: S25FL 016 DEVICE FAMILY S25FL Spansion S25FL016A Valid Combinations Base Ordering Part Number Speed Option S25FL016A 0L Notes 1. Contact your ...

  • Page 11

    Spansion SPI Modes A microcontroller can use either of its two SPI modes to control Spansion SPI Flash memory devices: CPOL = 0, CPHA = 0 (Mode 0) CPOL = 1, CPHA = 1 (Mode ...

  • Page 12

    Device Operations All Spansion SPI devices (S25FL-A) accept and output data in bytes (8 bits at a time). 7.1 Byte or Page Programming Programming data requires two commands: Write Enable (WREN), which is one byte, and a Page Program ...

  • Page 13

    – Write Disable (WRDI) – Write Status Register (WRSR) Software Protected Mode (SPM): The Block Protect (BP2, BP1, BP0) bits define the section of the memory array that can be read but not programmed or erased. ...

  • Page 14

    Sector Address Table Table 8.1 shows the size of the memory array, sectors, and pages. The device uses pages to cache the program data before the data is programmed into the memory array. Each page or byte can be ...

  • Page 15

    Command Definitions The host system must shift all commands, addresses, and data in and out of the device, beginning with the most significant bit. On the first rising edge of SCK after CS# is driven ...

  • Page 16

    Read Data Bytes at Higher Speed (FAST_READ) The FAST_READ command reads data from the memory array at the frequency (f input, with a maximum speed of 50 MHz. The host system must first select the device by driving CS# ...

  • Page 17

    Figure 9.3 Read Identification (RDID) Command Sequence and Data-Out Sequence CS# 0 Mode 3 SCK Mode 0 SI Hi-Z SO Manufacturer Identification 9.4 Write Enable (WREN) The Write Enable (WREN) command (see enables the device to ...

  • Page 18

    Read Status Register (RDSR) The Read Status Register (RDSR) command outputs the state of the Status Register bits. the status register bits and their functions. The RDSR command may be written at any time, even while a program, erase, ...

  • Page 19

    The following describes the status and control bits of the Status Register. Write In Progress (WIP) bit: Indicates whether the device is busy performing a Write Status Register, program, or erase operation. This bit is read-only, ...

  • Page 20

    W# Signal SRWD Bit Mode 1 1 Software 1 0 Protected (SPM Hardware 0 1 Protected (HPM) Note As defined by the values in the Block Protect (BP2, BP1, BP0) bits of the Status Register, as shown in ...

  • Page 21

    CS# Mode 3 SCK Mode SCK MSB 9.9 Sector Erase (SE) The Sector Erase (SE) command sets all bits at all addresses within a specified sector to a ...

  • Page 22

    Bulk Erase (BE) The Bulk Erase (BE) command sets all the bits within the entire memory array to logic 1s. A WREN command is required prior to writing the PP command. The host system must drive CS# low, and ...

  • Page 23

    CS# Mode 3 SCK Mode 0 SI Hi-Z SO 9.12 Release from Deep Power Down (RES) The device requires the Release from Deep Power Down (RES) command to exit the Deep Power Down mode. When the ...

  • Page 24

    When CS# is driven high, the device transitions from DP mode to the standby mode after a delay of t previously described. The RES command always provides access to the Electronic Signature of the device and can be applied even ...

  • Page 25

    Write Status Register, program, or erase command should be sent to the device until V min, plus a delay of t WEL bit is reset (0). Each device in the host system should have the ...

  • Page 26

    Operating Ranges Ambient Operating Temperature (T Positive Power Supply Note Operating ranges define those limits between which functionality of the device is guaranteed. 14. DC Characteristics This section summarizes the DC Characteristics of the device. Designers should check that ...

  • Page 27

    Symbol C L 16. AC Characteristics Symbol (Notes) F SCK Clock Frequency READ command SCK SCK Clock Frequency for: F SCK FAST_READ, PP, SE, BE, DP, RES, WREN, WRDI, RDSR, WRSR t Clock Rise Time (Slew ...

  • Page 28

    CS# t CSH SCK SI Hi-Z SO CS# SCK Figure 16.1 SPI Mode 0 ...

  • Page 29

    CS# SCK SO SI HOLD# Figure 16.4 Write Protect Setup and Hold Timing during WRSR when SRWD=1 W# CS# SCK SI Hi-Z SO August 28, 2006 S25FL016A_00_C0 ...

  • Page 30

    Physical Dimensions 17.1 SOC008 wide—8-pin Plastic Small Outline Package (208 mils Body Width E1 PACKAGE SOC 008 (inches) SOC 008 (mm) JEDEC SYMBOL MIN MAX ...

  • Page 31

    17.2 SO3 016 wide—16-pin Plastic Small Outline Package (300-mil Body Width) PACKAGE SO3 016 (inches) SO3 016 (mm) JEDEC MS-013(D)AA MS-013(D)AA SYMBOL MIN MAX MIN A 0.093 0.104 2.35 A1 0.004 0.012 0.10 A2 0.081 0.104 ...

  • Page 32

    WSON 8-contact ( mm) No-Lead Package D N 0.30 DIA TYP 0. TOP VIEW 2X 0. 0.05 C SEATING PLANE A1 L e/2 QUAD FLAT NO LEAD ...

  • Page 33

    18. Revision History Section Revision A (July 13, 2004) Global Initial release. Revision A1 (September 13, 2004) Connection Diagrams Added the WSON 6x8mm pin out. Changed OPN to reflect Device technology identification change from M to ...

  • Page 34

    Colophon The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated ...