Z0103MN0135 NXP [NXP Semiconductors], Z0103MN0135 Datasheet
Z0103MN0135
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Z0103MN0135 Summary of contents
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Z0103MN0 4Q Triac Rev. 01 — 3 January 2011 1. Product profile 1.1 General description Planar passivated sensitive gate four quadrant triac in a SOT223 (SC-73) surface-mountable plastic package intended for applications requiring enhanced immunity to noise and direct interfacing ...
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NXP Semiconductors Table 1. Symbol Static characteristics Pinning information Table 2. Pinning information Pin Symbol Description 1 T1 main terminal main terminal gate 4 T2 main terminal 2 3. Ordering information ...
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NXP Semiconductors 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V repetitive peak off-state voltage DRM I RMS on-state current T(RMS) I non-repetitive peak on-state TSM current 2 2 ...
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NXP Semiconductors 2.0 conduction form P angle factor tot (W) (degrees 2.8 90 2.2 120 1.9 1.2 180 1.57 0.8 0.4 0.0 0 0.2 Fig 3. Total power dissipation as a function of RMS on-state ...
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NXP Semiconductors TSM ( (1) ( Fig 5. Non-repetitive peak on-state current as a function of pulse width; maximum values 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter R thermal ...
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NXP Semiconductors 3.8 min 1.5 min 1.5 min (3 ) 1.5 min 4.6 All dimensions are in mm Fig 6. Minimum footprint SOT223 Fig 8. Transient thermal impedance from junction to solder point as a function of pulse width Z0103MN0 ...
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NXP Semiconductors 7. Characteristics Table 7. Characteristics Symbol Parameter Static characteristics I gate trigger current GT I latching current L I holding current H V on-state voltage T V gate trigger voltage GT I off-state current D Dynamic characteristics dV ...
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NXP Semiconductors GT( (1) (2) (3) ( (1) T2- G+ (2) T2- G- (3) T2+ G- (4) T2+ G+ Fig 9. Normalized gate trigger current as a function ...
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NXP Semiconductors Fig 13. Normalized critical rate of rise of off-state voltage as a function of junction temperature; typical values Fig 14. Normalized holding current as a function of junction temperature Z0103MN0 Product data sheet 1.6 A 1.2 0.8 0.4 ...
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NXP Semiconductors 8. Package outline Plastic surface-mounted package with increased heatsink; 4 leads DIMENSIONS (mm are the original dimensions) UNIT 1.8 0.10 0.80 3.1 mm 1.5 0.01 0.60 2.9 ...
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NXP Semiconductors 9. Soldering 1.3 1 Fig 16. Reflow soldering footprint for SOT223 (SOT223) 1.9 1 Fig 17. Wave soldering footprint for SOT223 (SOT223) Z0103MN0 Product data sheet 7 3.85 3.6 3.5 0.3 4 3.9 ...
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NXP Semiconductors 10. Revision history Table 8. Revision history Document ID Release date Z0103MN0 v.1 20110103 Z0103MN0 Product data sheet Data sheet status Change notice Product data sheet - All information provided in this document is subject to legal disclaimers. ...
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NXP Semiconductors 11. Legal information 11.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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NXP Semiconductors agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document ...
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NXP Semiconductors 13. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.1 General description . . . ...