Z0103MN0135 NXP [NXP Semiconductors], Z0103MN0135 Datasheet - Page 6
Z0103MN0135
Manufacturer Part Number
Z0103MN0135
Description
4Q Triac Direct interfacing to logic level ICs
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1.Z0103MN0135.pdf
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NXP Semiconductors
Z0103MN0
Product data sheet
Fig 6.
Fig 8.
All dimensions are in mm
Minimum footprint SOT223
Transient thermal impedance from junction to solder point as a function of pulse width
min
min
1.5
1.5
(3 )
min
1.5
3.8 min
4.6
2.3
001aab508
All information provided in this document is subject to legal disclaimers.
6.3
Rev. 01 — 3 January 2011
Fig 7.
All dimensions are in mm
Printed-circuit board:
FR4 epoxy glass (1.6 mm thick),
copper laminate (35 um thick)
Printed-circuit board pad area SOT223
60
10
9
4.6
36
15
50
7
Z0103MN0
© NXP B.V. 2011. All rights reserved.
001aab509
4.5
18
4Q Triac
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