bgw211 NXP Semiconductors, bgw211 Datasheet - Page 4

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bgw211

Manufacturer Part Number
bgw211
Description
Power Wlan
Manufacturer
NXP Semiconductors
Datasheet
BGW211 Low-power WLAN SiP
Complete, single-package 802.11g solution for mobile phones & portable consumer devices
BGW211 specifications
BGW211 order information
Frequency bands
Modulations
Data rates
Receive power
Transmit power (15 dBm)
Power consumption for PA, RF,
baseband/MAC (typical)
Description
Low-power 802.11g SiP
Size
10 x 15 x 1.3 mm
2.4 to 2.5 GHz
DBPSK, DQPSK, CCK (DSSS),
OFDM
1, 2, 5.5, 11 Mbps
6, 9, 12, 18, 24, 36, 48, 54 Mbps
300 mW (802.11b)
400 mW (802.11g)
550 mW (802.11b)
600 mW (802.11g)
Standby: < 2 mW
Part number
BGW211
Philips Semiconductors
Philips Semiconductors is a worldwide company with over 100 sales
offices in more than 50 countries. For a complete up-to-date list of our
sales offices please e-mail sales.addresses@www.semiconductors.philips.
com. A complete list will be sent to you automatically. You can also visit
our website http://www.semiconductors.philips.com/sales.
© Koninklijke Philips Electronics N.V. 2005
All rights reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document
does not form part of any quotation or contract, is believed to be accurate and reliable
and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent or other industrial or intellectual property rights.
Published in USA
w w w . s e m i c o n d u c t o r s . p h i l i p s . c o m
document order number: 9397-750-14869
Date of release: March 2005
SCL 76

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