74HC3GU04DC,125 NXP Semiconductors, 74HC3GU04DC,125 Datasheet

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Inverter Rev. 04. — 11 January 2010 1. General description The 74HC3GU04 is a high-speed Si-gate CMOS device. This device provides three inverter gates with unbuffered outputs. The 74HC3GU04 has CMOS input switching levels and supply voltage range 2 ...

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... NXP Semiconductors 5. Functional diagram mna720 Fig 1. Logic symbol 6. Pinning information 6.1 Pinning 74HC3GU04 GND 4 001aak022 Fig 3. Pin configuration SOT505-2 (TSSOP8) and SOT765-1 (VSSOP8) 6.2 Pin description Table 3. Pin description Symbol Pin 1A, 2A 1Y, 2Y GND 74HC3GU04_4 Product data sheet Fig 2. IEC logic symbol ...

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... NXP Semiconductors 7. Functional description [1] Table 4. Function table Input [ HIGH voltage level LOW voltage level. 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC I input clamping current ...

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... NXP Semiconductors 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter V HIGH-level input IH voltage V LOW-level input IL voltage V HIGH-level output OH voltage V LOW-level output OL voltage I input leakage current I I supply current CC C input capacitance I [1] All typical values are measured ...

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... NXP Semiconductors Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Symbol Parameter Conditions t transition time nY; see power dissipation V = GND capacitance [1] All typical values are measured the same as t and PLH PHL [ the same as t and t ...

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... NXP Semiconductors negative pulse positive pulse Test data is given in Table 10. Definitions for test circuit Termination resistance should be equal to output impedance Load capacitance including jig and probe capacitance Load resistance Test selection switch. Fig 6. Test circuit for measuring switching times Table 10. ...

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... NXP Semiconductors 12.1 Additional characteristics Δ -------- g = Δ constant. O Fig 7. Test set-up for measuring forward transconductance (mA/ °C. T amb Fig 8. Typical forward transconductance as a function of supply voltage 74HC3GU04_4 Product data sheet R bias = 560 kΩ 0.47 μF 100 μF input output kHz Rev. 04 — 11 January 2010 ...

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... NXP Semiconductors 13. Typical transfer characteristics 150 I CC (μA) 120 0.4 0 Fig 9. Typical transfer characteristics 6 Fig 11. Typical transfer characteristics V 14. Application information Some applications for the 74HC3GU04 are: • Linear amplifier (see • Crystal oscillator (see 74HC3GU04_4 Product data sheet ...

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... NXP Semiconductors Remark: All values given are typical values unless otherwise specified ≥ 3 kΩ. R2 ≤ 1 MΩ. Open loop amplification: A Voltage amplification: V Unity gain bandwidth product is 5 MHz (typical). Input capacitance see Fig 12. Linear amplifier application (1) V (2) V (3) V Fig 13. Typical input capacitance as a function of the input voltage ...

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... NXP Semiconductors Test data is given in Table (typical (typical MΩ MΩ (typical). R2 optimum value depends on the frequency and required stability against changes 3.0 V and MHz Fig 14. Crystal oscillator application Table 11. External components for resonator (f < 1 MHz) Frequency R1 10 kHz to 15.9 kHz 2.2 MΩ ...

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... NXP Semiconductors 15. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.00 0.75 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...

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... NXP Semiconductors VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2 pin 1 index DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0. 0.12 0.00 0.60 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...

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... NXP Semiconductors XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 0.5 mm terminal 1 index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.35 2.1 3.1 mm 0.5 0.00 0.15 2.9 1.9 OUTLINE VERSION IEC SOT996 Fig 17. Package outline SOT996-2 (XSON8U) ...

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... NXP Semiconductors 16. Abbreviations Table 13. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 17. Revision history Table 14. Revision history Document ID Release date 74HC3GU04_4 20100111 • Modifications: Marking code for 74HC3GU04DP package changed from HU04 to HU4 ...

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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

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... NXP Semiconductors 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 4 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 12.1 Additional characteristics . . . . . . . . . . . . . . . . . 7 13 Typical transfer characteristics ...