pbss3515m NXP Semiconductors, pbss3515m Datasheet - Page 3

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pbss3515m

Manufacturer Part Number
pbss3515m
Description
Pbss3515m 15 V, 0.5 A Pnp Low Vcesat Biss Transistor
Manufacturer
NXP Semiconductors
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
pbss3515mB,315
Manufacturer:
MAXIM
Quantity:
5 700
Philips Semiconductors
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Notes
1. Refer to SOT883 standard mounting conditions.
2. Device mounted on an FR4 printed-circuit board, single-sided copper, tinplated, standard footprint, with 60 m
3. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 1 cm
THERMAL CHARACTERISTICS
Notes
1. Refer to SOT883 standard mounting conditions.
2. Device mounted on an FR4 printed-circuit board, single-sided copper, tinplated, standard footprint, with 60 m
3. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 1 cm
4. Operated under pulsed conditions: duty cycle
Soldering
Reflow soldering is the only recommended soldering method.
2003 Jul 22
V
V
V
I
I
I
P
T
T
T
R
SYMBOL
SYMBOL
C
CM
BM
stg
j
amb
CBO
CEO
EBO
tot
th j-a
15 V, 0.5 A
PNP low V
copper strip line.
copper strip line.
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current (DC)
peak collector current
peak base current
total power dissipation
storage temperature
junction temperature
operating ambient temperature
thermal resistance from junction to
ambient
CEsat
PARAMETER
PARAMETER
(BISS) transistor
open emitter
open base
open collector
notes 1 and 2
T
T
in free air; notes 1 and 2
in free air; notes 1, 3 and 4
amb
amb
20%, pulse width t
3
25 C; notes 1 and 2
25 C; note 1 and 3
CONDITIONS
CONDITIONS
p
30 ms.
65
65
MIN.
VALUE
500
290
PBSS3515M
250
430
+150
150
+150
Product specification
15
15
6
500
1
100
MAX.
UNIT
K/W
K/W
V
V
V
mA
A
mA
mW
mW
C
C
C
2
2
.
.
UNIT

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