PCF88831 NXP [NXP Semiconductors], PCF88831 Datasheet
PCF88831
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PCF88831 Summary of contents
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PCF8883 Capacitive proximity switch with auto-calibration, large voltage operating range and very low power consumption Rev. 2 — 8 March 2011 1. General description The integrated circuit PCF8883 is a capacitive proximity switch that uses a patented (EDISEN) digital method ...
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NXP Semiconductors 3. Applications Proximity detection Proximity sensing in Mobile phones Portable entertainment units Switch for medical applications Switch for use in explosive environments Vandal proof switches Transportation: Switches in or under upholstery, leather, handles, mats, and glass Buildings: switch ...
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NXP Semiconductors 6. Block diagram IN (1) 150 nA. Fig 1. PCF8883 Product data sheet Capacitive proximity switch with auto-calibration V DD(INTREGD) V ref f s & & I sink V SS Block diagram of PCF8883 All information provided in ...
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NXP Semiconductors 7. Pinning information 7.1 Pinning Fig 2. 7.2 Pin description Table 3. Symbol IN TYPE CPC OUT CLIN V DD(INTREGD) PCF8883 Product data sheet Capacitive proximity switch with auto-calibration 1 IN TYPE 2 PCF8883 ...
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NXP Semiconductors 8. Functional description Figure chip-internal RC timing circuit, to which the external sensing plate is connected dch via pin IN, is compared to the discharge time (t RC timing circuit. Both RC timing ...
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NXP Semiconductors If the capacitance on pin IN increases, the discharge time t will take longer for the voltage on the corresponding comparator to drop below V once this happens, the comparator output will become LOW and this results in ...
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NXP Semiconductors The counter, following the sensor logic depicted in CDN respectively. The counter is reset every time the pulse sequence changes from CUP to CDN or vice versa. Pin OUT will only be activated when a sufficient number of ...
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NXP Semiconductors Capacitance on input OUT (push-button) OUT (toggle) OUT · 2 ms/nF clk(H) TYPE (pulse) Fig 5. Switching modes timing diagram of PCF8883 8.2 Voltage regulator The PCF8883 implements a chip-internal voltage regulator supplied by pin ...
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NXP Semiconductors 9. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter tot V ESD stg T amb [1] ...
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NXP Semiconductors 10. Static characteristics Table 5. Static characteristics ° +25 C; unless otherwise specified. DD amb Symbol Parameter V supply voltage DD V lock-in voltage lockin V internal regulated supply voltage DD(INTREGD) ΔV ...
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NXP Semiconductors 11. Dynamic characteristics Table 6. Dynamic characteristics pF 470 nF CLIN CPC Symbol Parameter C capacitance on pin CLIN CLIN C capacitance on pin CPC CPC N ...
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NXP Semiconductors 12. Characteristic curves 12.1 Power consumption Fig 7. Fig 8. PCF8883 Product data sheet Capacitive proximity switch with auto-calibration 3 (μA) 3.0 2.5 2 °C. Idle state kHz; T ...
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NXP Semiconductors Fig 9. 12.2 Typical reaction time Fig 10. Switching time (t PCF8883 Product data sheet Capacitive proximity switch with auto-calibration 4 (μA) 3.5 3.0 2.5 2.0 1.5 250 750 = 25 °C. Idle state ...
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NXP Semiconductors Fig 11. Switching time (t Fig 12. Switching time (t PCF8883 Product data sheet Capacitive proximity switch with auto-calibration 250 t sw (ms) 200 150 100 ° ...
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NXP Semiconductors 12.3 Reservoir capacitor voltage Fig 13. Input voltage on pin CPC (V Fig 14. Input voltage on pin CPC (V PCF8883 Product data sheet Capacitive proximity switch with auto-calibration 3 V I(CPC) ( ...
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NXP Semiconductors 13. Application information Figure 15 connected to pin V both V DD SENSING PLATE COAXIAL CABLE C SENS C = sensing plate capacitance. SENS The coaxial cable is optional. Fig 15. Typical application The sampling rate is determined ...
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NXP Semiconductors interference. Pin CPC has a high-impedance and is sensitive to leakage currents. Therefore C type. When limiting the maximum input capacitance and the minimum operating temperature to −20 °C then the minimum operating voltage can ...
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NXP Semiconductors 14. Package outline SOIC8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 e Dimensions Unit max 1.73 0.25 1.48 mm nom min 1.37 0.10 ...
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NXP Semiconductors Fig 17. Three dimensional package drawing of PCF8883 (SOIC8) 15. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note ...
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NXP Semiconductors 15.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the ...
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NXP Semiconductors Fig 18. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 16. Abbreviations Table 9. Acronym CMOS HBM IC MM MOS MOSFET MSL PCB ...
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NXP Semiconductors 17. References [1] AN10365 — Surface mount reflow soldering description [2] AN10832 — PCF8883 - capacitive proximity switch with auto-calibration [3] IEC 60134 — Rating systems for electronic tubes and valves and analogous semiconductor devices [4] IEC 61340-5 ...
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NXP Semiconductors 19. Legal information 19.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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NXP Semiconductors Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified ...
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NXP Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . ...