PCF8883T NXP [NXP Semiconductors], PCF8883T Datasheet

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PCF8883T

Manufacturer Part Number
PCF8883T
Description
Capacitive proximity switch with auto-calibration, large voltage operating range and very low power consumption
Manufacturer
NXP [NXP Semiconductors]
Datasheet

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1. General description
2. Features
1.
The definition of the abbreviations and acronyms used in this data sheet can be found in
The integrated circuit PCF8883 is a capacitive proximity switch that uses a patented
(EDISEN) digital method to detect a change in capacitance on a remote sensing plate.
Changes in the static capacitance (as opposed to dynamic capacitance changes) are
automatically compensated using continuous auto-calibration. Remote sensing plates
(e.g. conductive foil) can be connected directly to the IC
cable.
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PCF8883
Capacitive proximity switch with auto-calibration, large
voltage operating range and very low power consumption
Rev. 01 — 16 October 2009
Dynamic proximity switch
Digital processing method
Adjustable sensitivity, can be made very high
Adjustable response time
Wide input capacitance range (10 pF to 60 pF)
Automatic calibration
A large distance (several meters) between the sensing plate and the IC is possible
Open-drain output (P-type MOSFET, external load between pin and ground)
Designed for battery powered applications (I
Output configurable as push-button, toggle, or pulse
Wide voltage operating range (V
Large temperature operating range (T
Internal voltage regulator
Available in SOIC8 (other packages available on request for larger quantities)
DD
= 3 V to 9 V)
amb
= 40 C to +85 C)
DD
= 3 A, typical)
Section
1
or remotely using a coaxial
16.
Product data sheet

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PCF8883T Summary of contents

Page 1

PCF8883 Capacitive proximity switch with auto-calibration, large voltage operating range and very low power consumption Rev. 01 — 16 October 2009 1. General description The integrated circuit PCF8883 is a capacitive proximity switch that uses a patented (EDISEN) digital method ...

Page 2

... Table 1. Ordering information Type number Package Name PCF8883T SOIC8 5. Marking Table 2. Type number PCF8883T PCF8883_1 Product data sheet Capacitive proximity switch with auto-calibration Description plastic small outline package; 8 leads; body width 3.9 mm Marking codes Rev. 01 — 16 October 2009 PCF8883 Marking code PCF8883 © ...

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NXP Semiconductors 6. Block diagram IN (1) 150 nA. Fig 1. PCF8883_1 Product data sheet Capacitive proximity switch with auto-calibration V DD(INTREGD) V ref f s & & I sink V SS Block diagram of PCF8883 Rev. 01 — 16 ...

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NXP Semiconductors 7. Pinning information 7.1 Pinning Fig 2. 7.2 Pin description Table 3. Symbol IN TYPE CPC OUT CLIN V DD(INTREGD) PCF8883_1 Product data sheet Capacitive proximity switch with auto-calibration 1 IN TYPE 2 PCF8883 ...

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NXP Semiconductors 8. Functional description Figure chip-internal RC timing circuit, to which the external sensing plate is connected dch via pin IN, is compared to the discharge time (t RC timing circuit. Both RC timing ...

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NXP Semiconductors If the capacitance on pin IN increases, the discharge time t will take longer for the voltage on the corresponding comparator to drop below V once this happens, the comparator output will become LOW and this results in ...

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NXP Semiconductors The counter, following the sensor logic depicted in CDN respectively. The counter is reset every time the pulse sequence changes from CUP to CDN or vice versa. Pin OUT will only be activated when a sufficient number of ...

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NXP Semiconductors Capacitance on input OUT (push-button) OUT (toggle) OUT · 2 ms/nF clk(H) TYPE (pulse) Fig 5. Switching modes timing diagram of PCF8883 8.2 Voltage regulator The PCF8883 implements a chip-internal voltage regulator supplied by pin ...

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NXP Semiconductors 9. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage DD V input voltage I I output current O I ground supply current SS I input ...

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NXP Semiconductors 10. Static characteristics Table 5. Static characteristics +25 C; unless otherwise specified. DD amb Symbol Parameter V supply voltage DD V lock-in voltage lockin V internal regulated supply voltage V DD(INTREGD) V ...

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NXP Semiconductors 11. Dynamic characteristics Table 6. Dynamic characteristics pF 470 nF CLIN CPC Symbol Parameter C capacitance on pin CLIN CLIN C capacitance on pin CPC CPC N ...

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NXP Semiconductors 12. Characteristic curves 12.1 Power consumption Fig 7. Fig 8. PCF8883_1 Product data sheet Capacitive proximity switch with auto-calibration 3 3.0 2.5 2 Idle state kHz ...

Page 13

NXP Semiconductors Fig 9. 12.2 Typical reaction time Fig 10. Switching time (t PCF8883_1 Product data sheet Capacitive proximity switch with auto-calibration 4 3.5 3.0 2.5 2.0 1.5 250 750 Idle state ...

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NXP Semiconductors Fig 11. Switching time (t Fig 12. Switching time (t PCF8883_1 Product data sheet Capacitive proximity switch with auto-calibration 250 t sw (ms) 200 150 100 ...

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NXP Semiconductors 12.3 Reservoir capacitor voltage Fig 13. Input voltage on pin CPC (V Fig 14. Input voltage on pin CPC (V PCF8883_1 Product data sheet Capacitive proximity switch with auto-calibration 3 V I(CPC) ( ...

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NXP Semiconductors 13. Application information Figure 15 connected to pin V both V DD SENSING PLATE COAXIAL CABLE C SENS C = sensing plate capacitance. SENS The coaxial cable is optional. Fig 15. Typical application The sampling rate is determined ...

Page 17

NXP Semiconductors The sensitivity of the sensor can be influenced by the sensing plate area and capacitor C . The sensitivity is significantly reduced when C CPC sensitivity is desired C interference. Pin CPC has high-impedance and is sensitive to ...

Page 18

NXP Semiconductors 14. Package outline SOIC8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 e Dimensions Unit max 1.73 0.25 1.48 mm nom min 1.37 0.10 ...

Page 19

NXP Semiconductors Fig 17. Three dimensional package drawing of PCF8883 (SOIC8) 15. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note ...

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NXP Semiconductors 15.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the ...

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NXP Semiconductors Fig 18. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 16. Abbreviations Table 9. Acronym CMOS HBM IC MM MOS MOSFET MSL ...

Page 22

NXP Semiconductors 17. References [1] AN10365 — Surface mount reflow soldering description [2] AN10832 — PCF8883 - capacitive proximity switch with auto-calibration [3] IEC 60134 — Rating systems for electronic tubes and valves and analogous semiconductor devices [4] IEC 61340-5 ...

Page 23

NXP Semiconductors 19. Legal information 19.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...

Page 24

NXP Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

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