PCA9672BS

Manufacturer Part NumberPCA9672BS
DescriptionRemote 8-bit I/O expander for Fm+ I2C-bus with interrupt and reset
ManufacturerNXP [NXP Semiconductors]
PCA9672BS datasheet
 


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PCA9672
Remote 8-bit I/O expander for Fm+ I
reset
Rev. 02 — 6 July 2007
1. General description
The PCA9672 provides general purpose remote I/O expansion for most microcontroller
families via the two-line bidirectional bus (I
family.
The PCA9672 is a drop-in upgrade for the PCF8574 providing higher Fast-mode Plus
(Fm+) I
dimming of LEDs, higher I
can be on the bus without the need for bus buffers, higher total package sink capacity
(200 mA versus 100 mA) that supports having all LEDs on at the same time and more
device addresses (16 versus 8) are available to allow many more devices on the bus
without address conflicts.
The difference between the PCA9672 and the PCF8574 is that the A2 address pin is
replaced by the RESET input on the PCA9672.
The device consists of an 8-bit quasi-bidirectional port and an I
PCA9672 has low current consumption and include latched outputs with 25 mA high
current drive capability for directly driving LEDs.
The PCA9672 possesses an interrupt line (INT) that can be connected to the interrupt
logic of the microcontroller. By sending an interrupt signal on this line, the remote I/O can
inform the microcontroller if there is incoming data on its ports without having to
communicate via the I
The internal Power-On Reset (POR), hardware reset pin (RESET), or Software Reset
sequence initializes the I/Os as inputs.
2. Features
I
1 MHz I
I
Compliant with the I
I
SDA with 30 mA sink capability for 4000 pF buses
I
2.3 V to 5.5 V operation with 5.5 V tolerant I/Os
I
8-bit remote I/O pins that default to inputs at power-up
I
Latched outputs with 25 mA sink capability for directly driving LEDs
I
Total package sink capability of 200 mA
I
Active LOW open-drain interrupt output
I
16 programmable slave addresses using 2 address pins
I
Readable device ID (manufacturer, device type, and revision)
2
C-bus speeds (1 MHz versus 400 kHz) so that the output can support PWM
2
C-bus drive (30 mA versus 3 mA) so that many more devices
2
C-bus.
2
C-bus interface
2
C-bus Fast and Standard modes
2
C-bus with interrupt and
Product data sheet
2
C-bus) and is a part of the Fast-mode Plus
2
C-bus interface. The

PCA9672BS Summary of contents

  • Page 1

    PCA9672 Remote 8-bit I/O expander for Fm+ I reset Rev. 02 — 6 July 2007 1. General description The PCA9672 provides general purpose remote I/O expansion for most microcontroller families via the two-line bidirectional bus (I family. The PCA9672 is ...

  • Page 2

    ... I Medical equipment I PLCs I Cellular telephones I Gaming machines I Instrumentation and test measurement 4. Ordering information Table 1. Type number PCA9672BS PCA9672D PCA9672PW PCA9672 PCA9672_2 Product data sheet Remote 8-bit I/O expander for Fm+ I Ordering information Topside Package mark Name Description 672 HVQFN16 plastic thermal enhanced very thin quad fl ...

  • Page 3

    NXP Semiconductors 5. Block diagram INT AD0 AD1 SCL SDA RESET Fig 1. Block diagram of PCA9672 data from Shift Register data to Shift Register Fig 2. Simplified schematic diagram PCA9672_2 Product ...

  • Page 4

    ... P0 PCA9672PW Fig 4. Pin configuration for TSSOP16 12 SCL 11 INT PCA9672BS 002aac325 Description address input 0 address input 1 reset input (active LOW) quasi-bidirectional I/O 0 quasi-bidirectional I/O 1 quasi-bidirectional I/O 2 quasi-bidirectional I/O 3 supply ground quasi-bidirectional I/O 4 quasi-bidirectional I/O 5 quasi-bidirectional I/O 6 © NXP B.V. 2007. All rights reserved. ...

  • Page 5

    NXP Semiconductors Table 2. Symbol P7 INT SCL SDA V DD [1] HVQFN package die supply ground is connected to both the V pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board-level ...

  • Page 6

    NXP Semiconductors 7.1.1 Address map Table 3. AD1 SCL SCL SDA SDA SCL SCL SDA SDA 7.2 Software Reset Call, and device ID addresses ...

  • Page 7

    NXP Semiconductors 7.2.1 Software Reset The Software Reset Call allows all the devices in the I state value through a specific formatted I implies that the I The Software Reset sequence is defined as following START command is ...

  • Page 8

    NXP Semiconductors 7.2.2 Device ID (PCA9672 ID field) The Device ID field is a 3-byte read-only (24 bits) word giving the following information: • 8 bits with the manufacturer name, unique per manufacturer (for example, NXP). • 13 bits with ...

  • Page 9

    NXP Semiconductors S 1 START condition M7 manufacturer name = 00000000 Fig 11. Device ID field reading 8. I/O programming 8.1 Quasi-bidirectional I/O architecture The PCA9672’s 8 ports (see input or output ports. Input data is transferred from the ports ...

  • Page 10

    NXP Semiconductors SCL slave address SDA START condition write to port data output from port P5 output voltage P5 pull-up output current INT Fig 12. ...

  • Page 11

    NXP Semiconductors 8.4 Power-on reset When power is applied reset condition until V and the PCA9672 registers and I states. Thereafter V 8.5 Interrupt output (INT) The PCA9672 provides an open-drain interrupt (INT) which can be fed ...

  • Page 12

    NXP Semiconductors 9. Characteristics of the I 2 The I C-bus is for 2-way, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be ...

  • Page 13

    NXP Semiconductors SDA SCL MASTER TRANSMITTER/ RECEIVER Fig 17. System configuration 9.3 Acknowledge The number of data bytes transferred between the START and the STOP conditions from transmitter to receiver is not limited. Each byte of eight bits is followed ...

  • Page 14

    NXP Semiconductors 10. Application design-in information 10.1 Bidirectional I/O expander applications In the 8-bit I/O expander application shown in P7 are outputs. When used in this configuration, during a write, the input (P0 and P1) must be written as HIGH ...

  • Page 15

    NXP Semiconductors 11. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol tot P/out T stg T amb [1] Total package ...

  • Page 16

    NXP Semiconductors Table 5. Static characteristics Symbol Parameter I/Os LOW-level output current OL I total LOW-level output current OL(tot) I HIGH-level output ...

  • Page 17

    NXP Semiconductors 13. Dynamic characteristics Table 6. Dynamic characteristics Symbol Parameter f SCL clock frequency SCL t bus free time between a BUF STOP and START ...

  • Page 18

    NXP Semiconductors [ total capacitance of one bus line in pF. b [4] A master device must internally provide a hold time of at least 300 ns for the SDA signal (refer to the V bridge the undefined ...

  • Page 19

    NXP Semiconductors 14. Package outline HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS ...

  • Page 20

    NXP Semiconductors SO16: plastic small outline package; 16 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. ...

  • Page 21

    NXP Semiconductors TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm ...

  • Page 22

    NXP Semiconductors 15. Handling information Inputs and outputs are protected against electrostatic discharge in normal handling. However completely safe you must take normal precautions appropriate to handling integrated circuits. 16. Soldering This text provides a very brief insight ...

  • Page 23

    NXP Semiconductors • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities ...

  • Page 24

    NXP Semiconductors Fig 26. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 17. Abbreviations Table 9. Acronym CDM CMOS ESD GPIO HBM LED IC ...

  • Page 25

    ... Legal texts have been adapted to the new company name where appropriate. • Table 1 “Ordering – changed Topside mark for PCA9672BS from “9672” to “672” – changed Topside mark for PCA9672PW from “9672” to “PCA9672” • Table 5 “Static – sub-section “Supplies”: changed I – ...

  • Page 26

    NXP Semiconductors 19. Legal information 19.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...

  • Page 27

    NXP Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...