ADSP-BF561SBBCZ-5A2 AD [Analog Devices], ADSP-BF561SBBCZ-5A2 Datasheet - Page 44

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ADSP-BF561SBBCZ-5A2

Manufacturer Part Number
ADSP-BF561SBBCZ-5A2
Description
Manufacturer
AD [Analog Devices]
Datasheet
ADSP-BF561
Figure 41. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
Figure 42. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
Figure 43. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
30
25
20
15
10
20
18
16
14
12
10
10
5
0
8
6
4
2
0
9
8
7
6
5
4
3
2
1
0
0
0
0
50
50
50
for Driver B at V
for Driver C at V
LOAD CAPACITANCE (pF)
for Driver C at V
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
100
100
100
RISE TIME
RISE TIME
RISE TIME
DDEXT
DDEXT
DDEXT
150
150
150
(max)
(max)
(min)
FALL TIME
FALL TIME
FALL TIME
200
200
200
Rev. B | Page 44 of 64 | June 2007
250
250
250
Figure 44. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
Figure 45. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
ENVIRONMENTAL CONDITIONS
To determine the junction temperature on the application
printed circuit board use:
where:
T
T
center of package.
Ψ
P
the method to calculate P
Values of θ
circuit board design considerations. θ
order approximation of T
where:
T
D
J
CASE
A
JT
= junction temperature ( C).
= power dissipation (see
= ambient temperature ( C).
14
12
10
18
16
14
12
10
= from
8
6
4
2
0
8
6
4
2
0
0
0
= case temperature ( C) measured by customer at top
JA
Table 31 on Page 45
are provided for package comparison and printed
50
50
T
J
T
for Driver D at V
for Driver D at V
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
J
=
=
T
D
J
100
).
100
by the equation:
CASE
T
Power Dissipation on Page 42
A
RISE TIME
RISE TIME
+
+
through
(
θ
(
DDEXT
Ψ
DDEXT
DDEXT
JA
JT
×
150
150
(max)
(min)
JA
×
P
FALL TIME
FALL TIME
can be used for a first
D
P
Table 33 on Page
)
D
)
200
200
for
45.
250
250

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