ADSP-BF561SBBCZ-5A2 AD [Analog Devices], ADSP-BF561SBBCZ-5A2 Datasheet - Page 45

• Manufacturer Part Number: ADSP-BF561SBBCZ-5A2
• Manufacturer: AD [Analog Devices]

In
with JEDEC standards JESD51–2 and JESD51–6, and the junc-
tion-to-board measurement complies with JESD51–8. The
junction-to-case measurement complies with MIL-STD-883
(Method 1012.1). All measurements use a 2S2P JEDEC test
board.
Thermal resistance θ
of merit relating to performance of the package and board in a
convective environment. θ
under two conditions of airflow. θ
extracted from the periphery of the board. Ψ
correlation between T
package comparison and printed circuit board design
considerations.
Table 31. Thermal Characteristics for BC-256-4
(17 mm × 17 mm) Package
Table 32. Thermal Characteristics for BC-256-1
(12 mm × 12 mm) Package
Table 33. Thermal Characteristics for B-297 Package
Parameter
θ
θ
θ
θ
Ψ
Ψ
Ψ
Parameter
θ
θ
θ
θ
θ
Ψ
Ψ
Ψ
Parameter
θ
θ
θ
θ
θ
Ψ
Ψ
Ψ
JA
JMA
JMA
JC
JA
JMA
JMA
JB
JC
JA
JMA
JMA
JB
JC
JT
JT
JT
JT
JT
JT
JT
JT
JT
Table 31
through
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Not Applicable
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Not Applicable
Not Applicable
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Not Applicable
Not Applicable
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Table
JA
J
in
and T
Table 31
33, airflow measurements comply
JMA
CASE
represents the thermal resistance
. Values of θ
through
JB
represents the heat
Table 33
JT
JB
n/a
n/a
n/a
n/a
Typical
18.1
15.9
15.1
3.72
0.11
0.18
0.18
Typical
25.6
22.4
21.6
18.9
4.85
0.15
Typical
20.6
17.8
17.4
16.3
7.15
0.37
represents the
are provided for
is the figure
Rev. B | Page 45 of 64 | June 2007
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ADSP-BF561