ADSP-BF606 AD [Analog Devices], ADSP-BF606 Datasheet - Page 42

• Manufacturer Part Number: ADSP-BF606
• Description: Blackfin Dual Core
• Manufacturer: AD [Analog Devices]

ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609
OUTLINE DIMENSIONS
Dimensions for the 19 mm × 19 mm CSP_BGA package in
Figure 11
SURFACE-MOUNT DESIGN
Table 17
dard design recommendations, refer to IPC-7351, Generic
Requirements for Surface-Mount Design and Land Pattern
Standard.
Table 17. BGA Data for Use with Surface-Mount Design
Package
BC-349-1
is provided as an aid to PCB design. For industry-stan-
are shown in millimeters.
CORNER
A1 BALL
1.50
1.36
1.21
Figure 11. 349-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
DETAIL A
TOP VIEW
19.10
19.00 SQ
18.90
COMPLIANT TO JEDEC STANDARDS MO-275-PPAB-2.
Rev. PrD | Page 42 of 44 | March 2012
Dimensions shown in millimeters
Package
Ball Attach Type
Solder Mask Defined
(BC-349-1)
1.10 REF
BSC SQ
16.80
SEATING
PLANE
BSC
0.80
22
21
20
19
18
17
DETAIL A
BOTTOM VIEW
16
15
BALL DIAMETER
14
13
12
11
Package
Solder Mask Opening
0.4 mm Diameter
10
0.50
0.45
0.40
9
Preliminary Technical Data
8
7
6
5
4
3
COPLANARITY
0.20
2
1
1.11
1.01
0.91
C
E
G
J
L
N
R
U
A
W
AA
0.35 NOM
0.30 MIN
B
D
F
H
K
M
P
T
V
Y
AB
A1 BALL
CORNER
Package
Ball Pad Size
0.5 mm Diameter