MK61FN1M0VMJ12 FREESCALE [Freescale Semiconductor, Inc], MK61FN1M0VMJ12 Datasheet - Page 26

• Manufacturer Part Number: MK61FN1M0VMJ12
• Description: K61 Sub-Family
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

General
5.4 Thermal specifications
5.4.1 Thermal operating requirements
5.4.2 Thermal attributes
1.
26
Single-layer (1s)
Four-layer (2s2p)
Single-layer (1s)
Four-layer (2s2p)
—
—
—
Board type
Symbol
T
T
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
J
A
Die junction temperature
Ambient temperature
Description
R
R
R
R
R
R
Ψ
Symbol
θJA
θJA
θJMA
θJMA
θJB
θJC
JT
Table 11. Thermal operating requirements
K61 Sub-Family Data Sheet, Rev. 4, 10/2012.
Thermal
resistance, junction
to ambient (natural
convection)
Thermal
resistance, junction
to ambient (natural
convection)
Thermal
resistance, junction
to ambient (200 ft./
min. air speed)
Thermal
resistance, junction
to ambient (200 ft./
min. air speed)
Thermal
resistance, junction
to board
Thermal
resistance, junction
to case
Thermal
characterization
parameter, junction
to package top
outside center
(natural
convection)
Description
43
28
36
25
17
8
2
256 MAPBGA
Min.
–40
–40
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Freescale Semiconductor, Inc.
Max.
125
105
1,
1,2,
1,3
1,3
4
5
6
Notes
2
3
Unit
°C
°C