UJA1069TW PHILIPS [NXP Semiconductors], UJA1069TW Datasheet - Page 41

• Manufacturer Part Number: UJA1069TW
• Description: LIN fail-safe system basis chip
• Manufacturer: PHILIPS [NXP Semiconductors]

NXP Semiconductors
8. Thermal characteristics
UJA1069_2
Preliminary data sheet
Fig 15. Thermal model of the HTSSOP32 package
Fig 16. Thermal model of the HTSSOP24 package
V1 dissipation
V1 dissipation
Rev. 02 — 5 March 2007
6 K/W
6 K/W
6 K/W
R th(c-a)
6 K/W
R th(c-a)
V3 dissipation
V3 dissipation
23 K/W
17 K/W
T
T
T
T
case
amb
case
amb
(heat sink)
(heat sink)
001aad671
other dissipation
other dissipation
LIN fail-safe system basis chip
001aae136
6 K/W
6 K/W
T
T
vj
vj
UJA1069
© NXP B.V. 2007. All rights reserved.
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