UJA1069TW PHILIPS [NXP Semiconductors], UJA1069TW Datasheet - Page 59

• Manufacturer Part Number: UJA1069TW
• Description: LIN fail-safe system basis chip
• Manufacturer: PHILIPS [NXP Semiconductors]

NXP Semiconductors
Fig 28. Package outline SOT864-1 (HTSSOP24)
UJA1069_2
Preliminary data sheet
HTSSOP24: plastic thermal enhanced thin shrink small outline package; 24 leads;
body width 4.4 mm; lead pitch 0.65 mm; exposed die pad
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
SOT864-1
VERSION
OUTLINE
Z
max
1.1
A
24
1
0.15
0.05
y
A
1
0.95
0.80
A
2
pin 1 index
0.25
IEC
e
A
3
exposed die pad
0.30
0.19
b
p
D
D
H
0.2
0.1
c
MO-153
JEDEC
D
7.9
7.7
(1)
b
REFERENCES
p
D
4.3
4.1
0
h
Rev. 02 — 5 March 2007
E
4.5
4.3
w
(2)
13
12
M
JEITA
3.3
3.1
E
E
h
scale
h
2.5
0.65
e
c
6.6
6.2
H
E
A
2
A
1
L
1
5 mm
detail X
0.75
0.50
L
p
0.2
v
LIN fail-safe system basis chip
H
E
PROJECTION
E
EUROPEAN
0.13
w
L
0.1
y
L
p
0.5
0.2
Z
UJA1069
© NXP B.V. 2007. All rights reserved.
(A
A
3
)
8
0
ISSUE DATE
04-09-23
05-12-06
X
A
v
SOT864-1
M
59 of 64
A