UJA1069TW PHILIPS [NXP Semiconductors], UJA1069TW Datasheet - Page 62

• Manufacturer Part Number: UJA1069TW
• Description: LIN fail-safe system basis chip
• Manufacturer: PHILIPS [NXP Semiconductors]

NXP Semiconductors
14. Revision history
Table 29.
UJA1069_2
Preliminary data sheet
Document ID
UJA1069_2
Modifications:
UJA1069_1
Revision history
Release date
20070305
20051222
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For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
The format of this data sheet has been redesigned to comply with the new identity guidelines of
NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Section
replaced t
Table
Table
Figure 24
Soldering information updated
Added Test information, see
Added
Added a second condition row to I
Changed in
Fig 29. Temperature profiles for large and small components
11: table note added
25: updated pin SDO conditions and pin LIN, parameter I
Figure 23
6: symbols corrected; replaced symbol t
MSL: Moisture Sensitivity Level
temperature
INTNH
and
Table note [2]
Figure 26
with t
INTN
Data sheet status
Preliminary data sheet
Objective data sheet
updated
Rev. 02 — 5 March 2007
of
= minimum soldering temperature
Section 11 “Test information”
Table 26
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
LIH
in
“V
Table 25
BAT14
” to “V
Change notice
-
-
RSTN(ext)
BAT42
”
with t
RSTN(CLT)
LIN fail-safe system basis chip
LIL
value
temperature
and with t
peak
Supersedes
UJA1069_1
-
UJA1069
© NXP B.V. 2007. All rights reserved.
RSTN(CHT)
001aac844
time
;
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