MC68HC908AP16CFA MOTOROLA [Motorola, Inc], MC68HC908AP16CFA Datasheet - Page 434

• Manufacturer Part Number: MC68HC908AP16CFA
• Description: Microcontrollers
• Manufacturer: MOTOROLA [Motorola, Inc]

Mechanical Specifications
25.2 48-Pin Low-Profile Quad Flat Pack (LQFP)
Data Sheet
434
B
B1
9
AB
AC
T
12
1
4X
SECTION AE–AE
0.080
4X
0.200 AC T–U
48
13
S1
0.200 AB T–U
BASE METAL
M
A1
F
D
AC
G
A
S
T–U
N
Z
Z
Freescale Semiconductor, Inc.
Z
Z
J
Figure 25-1. 48-Pin LQFP (Case #932)
37
24
For More Information On This Product,
AD
36
25
U
Go to: www.freescale.com
V1
0.080 AC
DETAIL Y
V
C
H
E
DETAIL AD
TOP & BOTTOM
DETAIL Y
M °
AE
W
P
T, U, Z
AE
AA
MC68HC908AP Family — Rev. 2.5
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE AB IS LOCATED AT BOTTOM OF
4. DATUMS T, U, AND Z TO BE DETERMINED AT
5. DIMENSIONS S AND V TO BE DETERMINED AT
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
7. DIMENSION D DOES NOT INCLUDE DAMBAR
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
R
Y14.5M, 1994.
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
DATUM PLANE AB.
SEATING PLANE AC.
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE AB.
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350.
0.0076.
DIM
AA
A1
B1
S1
V1
M
W
A
B
C
D
E
F
G
H
K
L
N
P
R
S
V
J
MILLIMETERS
1.400
0.170
1.350
0.170
0.050
0.090
0.500
0.090
0.150
L °
MIN
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
0.500 BSC
0.250 BSC
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
1°
12° REF
1.600
0.270
1.450
0.230
0.150
0.200
0.700
0.160
0.250
MAX
5°
MOTOROLA