SSTVF16859DGG PHILIPS [NXP Semiconductors], SSTVF16859DGG Datasheet - Page 15

• Manufacturer Part Number: SSTVF16859DGG
• Description: 13-bit 1 : 2 SSTL_2 registered buffer for DDR
• Manufacturer: PHILIPS [NXP Semiconductors]

Philips Semiconductors
13. Package outline
Fig 12. Package outline SOT646-1 (TSSOP64)
9397 750 15157
Product data sheet
TSSOP64: plastic thin shrink small outline package; 64 leads; body width 6.1 mm
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
64
mm
1
Z
VERSION
OUTLINE
SOT646-1
y
pin 1 index
max.
1.2
A
0.15
0.05
A
1
1.05
0.85
A
2
IEC
0.25
A
3
e
0.27
0.17
b
D
p
MO-153
JEDEC
0.2
0.2
0.1
0.1
c
REFERENCES
17.1
16.9
D
(1)
Rev. 02 — 19 July 2005
0
E
6.2
6.0
(2)
b p
JEITA
scale
2.5
0.5
e
w
M
H
8.3
7.9
33
32
E
5 mm
13-bit 1 : 2 SSTL_2 registered buffer for DDR
c
L
1
A
2
A
0.75
0.45
1
L
p
0.2
v
PROJECTION
H E
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
EUROPEAN
E
0.08
detail X
w
SSTVF16859
L
L
0.1
y
p
0.89
0.61
(A )
Z
3
ISSUE DATE
A
00-08-21
03-02-18
8
0
X
o
o
A
SOT646-1
v
M
15 of 23
A