SSTVF16859DGG PHILIPS [NXP Semiconductors], SSTVF16859DGG Datasheet - Page 23

• Manufacturer Part Number: SSTVF16859DGG
• Description: 13-bit 1 : 2 SSTL_2 registered buffer for DDR
• Manufacturer: PHILIPS [NXP Semiconductors]

Philips Semiconductors
22. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
8
9
10
11
11.1
12
13
14
14.1
14.2
14.3
14.4
14.5
15
16
17
18
19
20
21
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8
Recommended operating conditions. . . . . . . . 8
Static characteristics. . . . . . . . . . . . . . . . . . . . . 9
Dynamic characteristics . . . . . . . . . . . . . . . . . 11
Test information . . . . . . . . . . . . . . . . . . . . . . . . 14
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 21
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 22
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Contact information . . . . . . . . . . . . . . . . . . . . 22
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 7
AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . 12
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 18
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 18
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 19
Package related soldering information . . . . . . 19
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Published in The Netherlands
13-bit 1 : 2 SSTL_2 registered buffer for DDR
SSTVF16859
Document number: 9397 750 15157
Date of release: 19 July 2005