SSTVF16859DGG PHILIPS [NXP Semiconductors], SSTVF16859DGG Datasheet - Page 20

• Manufacturer Part Number: SSTVF16859DGG
• Description: 13-bit 1 : 2 SSTL_2 registered buffer for DDR
• Manufacturer: PHILIPS [NXP Semiconductors]

Philips Semiconductors
15. Abbreviations
9397 750 15157
Product data sheet
[4]
[5]
[6]
[7]
[8]
[9]
Table 14:
Acronym
DDR
DIMM
ESD
HBM
PRR
SSTL
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Abbreviations
Description
Double Data Rate
Dual In-line Memory Module
Electro Static Discharge
Human Body Model
Pulse Rate Repetition
Stub Series Terminated Logic
Rev. 02 — 19 July 2005
13-bit 1 : 2 SSTL_2 registered buffer for DDR
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
SSTVF16859
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