IS42S16100-10TI ISSI [Integrated Silicon Solution, Inc], IS42S16100-10TI Datasheet - Page 2

• Manufacturer Part Number: IS42S16100-10TI
• Description: 512K Words x 16 Bits x 2 Banks (16-MBIT) SYNCHRONOUS DYNAMIC RAM
• Manufacturer: ISSI [Integrated Silicon Solution, Inc]

2
IS42S16100
PIN FUNCTIONS
12, 39, 40, 42, 43,
2, 3, 5, 6, 8, 9, 11
45, 46, 48, 49
7, 13, 38, 44
4, 10, 41, 47
Pin No.
20 to 24
27 to 32
14, 36
26, 50
1, 25
19
16
34
35
18
17
15
Symbol
A0-A10
LDQM,
UDQM
GNDQ
I/O0 to
I/O15
V
GND
CAS
CKE
CLK
RAS
A11
V
CS
WE
CC
CC
Q
Power Supply Pin
Power Supply Pin
Power Supply Pin
Power Supply Pin
Input Pin
Input Pin
Input Pin
Input Pin
Input Pin
Input Pin
Input Pin
Input Pin
Input Pin
I/O Pin
Type
Function (In Detail)
A0 to A10 are address inputs. A0-A10 are used as row address inputs during active
command input and A0-A7 as column address inputs during read or write command
input. A10 is also used to determine the precharge mode during other commands. If
A10 is LOW during precharge command, the bank selected by A11 is precharged,
but if A10 is HIGH, both banks will be precharged.
When A10 is HIGH in read or write command cycle, the precharge starts
automatically after the burst access.
These signals become part of the OP CODE during mode register set command
input.
A11 is the bank selection signal. When A11 is LOW, bank 0 is selected and when
high, bank 1 is selected. This signal becomes part of the OP CODE during mode
register set command input.
CAS, in conjunction with the RAS and WE, forms the device command. See the
“Command Truth Table” item for details on device commands.
The CKE input determines whether the CLK input is enabled within the device. When
is CKE HIGH, the next rising edge of the CLK signal will be valid, and when LOW,
invalid. When CKE is LOW, the device will be in either the power-down mode, the
clock suspend mode, or the self refresh mode. The CKE is an asynchronous input.
CLK is the master clock input for this device. Except for CKE, all inputs to this device
are acquired in synchronization with the rising edge of this pin.
The CS input determines whether command input is enabled within the device.
Command input is enabled when CS is LOW, and disabled with CS is HIGH. The
device remains in the previous state when CS is HIGH.
I/O0 to I/O15 are I/O pins. I/O through these pins can be controlled in byte units
using the LDQM and UDQM pins.
LDQM and UDQM control the lower and upper bytes of the I/O buffers. In read
mode, LDQM and UDQM control the output buffer. When LDQM or UDQM is LOW,
the corresponding buffer byte is enabled, and when HIGH, disabled. The outputs go
to the HIGH impedance state when LDQM/UDQM is HIGH. This function
corresponds to OE in conventional DRAMs. In write mode, LDQM and UDQM control
the input buffer. When LDQM or UDQM is LOW, the corresponding buffer byte is
enabled, and data can be written to the device. When LDQM or UDQM is HIGH, input
data is masked and cannot be written to the device.
RAS, in conjunction with CAS and WE, forms the device command. See the
“Command Truth Table” item for details on device commands.
“Command Truth Table” item for details on device commands.
V
V
GNDQ is the output buffer ground.
GND is the device internal ground.
WE, in conjunction with RAS and CAS, forms the device command. See the
CC
CC
Integrated Silicon Solution, Inc. — www.issi.com —
Q is the output buffer power supply.
is the device internal power supply.
ISSI
1-800-379-4774
11/01/01
Rev. C
®