M48Z35-70MH1TR STMICROELECTRONICS [STMicroelectronics], M48Z35-70MH1TR Datasheet - Page 5

• Manufacturer Part Number: M48Z35-70MH1TR
• Description: 256 Kbit (32 Kbit x 8) ZEROPOWER SRAM
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

MAXIMUM RATING
Stressing the device above the rating listed in the
“Absolute Maximum Ratings” table may cause
permanent damage to the device. These are
stress ratings only and operation of the device at
these or any other conditions above those indicat-
ed in the Operating sections of this specification is
Table 2. Absolute Maximum Ratings
Note: 1. For DIP package: Soldering temperature not to exceed 260°C for 10 seconds (total thermal budget not to exceed 150°C for longer
T
Symbol
SLD
T
V
2. For SO package: Reflow at peak temperature of 215°C to 225°C for < 60 seconds (total thermal budget not to exceed 180°C for
V
P
T
STG
I
CC
O
IO
A
D
(1,2)
than 30 seconds).
between 90 to 120 seconds).
CAUTION: Negative undershoots below –0.3V are not allowed on any pin while in the Battery Back-up mode.
Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.
Ambient Operating Temperature
Storage Temperature (V
Lead Solder Temperature for 10 seconds
Input or Output Voltages
Supply Voltage
Output Current
Power Dissipation
CC
Off, Oscillator Off)
Parameter
not implied. Exposure to Absolute Maximum Rat-
ing conditions for extended periods may affect de-
vice
STMicroelectronics SURE Program and other rel-
evant quality documents.
SNAPHAT
Grade 1
Grade 6
reliability.
SOIC
®
Refer
–55 to 125
–0.3 to 7.0
–0.3 to 7.0
–40 to 85
–40 to 85
0 to 70
Value
260
M48Z35, M48Z35Y
20
1
also
to
Unit
mA
°C
°C
°C
°C
°C
W
V
V
5/20
the