HCS240DMSR INTERSIL [Intersil Corporation], HCS240DMSR Datasheet
HCS240DMSR
Related parts for HCS240DMSR
HCS240DMSR Summary of contents
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... CMOS/SOS Logic Family. The HCS240MS is supplied lead Ceramic flatpack (K suffi SBDIP Package (D suffix). Ordering Information PART NUMBER TEMPERATURE RANGE HCS240DMSR HCS240KMSR HCS240D/Sample HCS240K/Sample HCS240HMSR CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. ...
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Functional Diagram AO1 AI1 H = High Voltage Level, L =Low Voltage Level X = Immaterial, Z =High Impedance HCS240MS AO2 AO3 AO4 BO1 BO2 ...
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Absolute Maximum Ratings Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7.0V Input Voltage ...
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TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Propagation Delay TPHL1 VCC = 4.5V, VIH = 4.5V, VIL = 0V Propagation Delay TPLH1 VCC = 4.5V, VIH = 4.5V, VIL = 0V Propagation Delay TPZL1 VCC = 4.5V, VIH = ...
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TABLE 4. POST IRRADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Supply Current ICC VCC = 5.5V, VIN = VCC or GND Output Current IOH VCC = VIH = 4.5V, VOUT = VCC -0.4V, (Source) VIL = 0 Output Current (Sink) IOL ...
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CONFORMANCE GROUPS Initial Test (Preburn-In) Interim Test I (Postburn-In) Interim Test II (Postburn-In) PDA Interim Test III (Postburn-In) PDA Final Test Group A (Note 1) Group B Subgroup B-5 Subgroup B-6 Group D NOTE: 1. Alternate group A testing in ...
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Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method ...
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Propagation Delay Timing Diagram VIH INPUT VS VSS TPLH VOH VS OUTPUT VOL Transition Timing Diagram TTLH VOH 80% 20% OUTPUT VOL VOLTAGE LEVELS PARAMETER HCS VCC 4.50 VIH 4.50 VS 2.25 VIL 0 GND 0 Three-State High Timing Diagrams ...
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Three-State Low Timing Diagrams VIH INPUT VS VSS TPZL VOZ VT OUTPUT VOL THREE-STATE LOW VOLTAGE LEVELS PARAMETER HCS VCC 4.50 VIH 4.50 VS 2.25 VT 2.25 VW 0.90 GND 0 HCS240MS Three-State Low Load Circuit TPLZ VW UNITS V ...
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Die Characteristics DIE DIMENSIONS: 108 x 106 x 19 1mils METALLIZATION: Type Å Å Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness: 13k 2.6k WORST CASE CURRENT DENSITY <2 A/cm BOND ...