HCS241DMSR INTERSIL [Intersil Corporation], HCS241DMSR Datasheet
HCS241DMSR
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HCS241DMSR Summary of contents
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... CMOS/SOS Logic Family. The HCS241MS is supplied lead ceramic flatpack (K suffi SBDIP package (D suffix). Ordering Information PART NUMBER TEMPERATURE RANGE HCS241DMSR HCS241KMSR HCS241D/Sample HCS241K/Sample HCS241HMSR CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. ...
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Functional Diagram AO1 AI1 INPUTS AE AIn High Voltage Level L = Low Voltage Level X = Immaterial Z = High Impedance HCS241MS AO2 AO3 AO4 BO1 BO2 16 ...
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Absolute Maximum Ratings Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7.0V Input Voltage ...
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TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Propagation Delay TPLH1 VCC = 4.5V, VIH = 4.5V, VIL = 0V Propagation Delay TPHL1 VCC = 4.5V, VIH = 4.5V, VIL = 0V Propagation Delay TPZL1 VCC = 4.5V, VIH = ...
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TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Supply Current ICC VIN = 5.5V, VIN = VCC or GND Output Current (Sink) IOL VCC = VIH = 4.5V, VOUT = 0.4V, VIL = 0 Output Current (Source) IOH ...
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CONFORMANCE GROUPS Initial Test (Preburn-In) Interim Test I (Postburn-In) Interim Test II (Postburn-In) PDA Interim Test III (Postburn-In) PDA Final Test Group A (Note 1) Group B Subgroup B-5 Subgroup B-6 Group D NOTE: 1. Alternate Group A testing in ...
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Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method ...
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Propagation Delay Timing Diagram and Load Circuit VIH INPUT VS VSS TPLH VOH VS OUTPUT VOL Three-State High Timing Diagram and Load Circuit VIH INPUT VS VSS TPZH VOH VT OUTPUT VOZ Three-State Low Timing Diagram and Load Circuit VIH ...
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Die Characteristics DIE DIMENSIONS: 108 x 106 mils METALLIZATION: Type: AlSi Å Å Metal Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness:13k 2.6k WORST CASE CURRENT DENSITY < 2 A/cm BOND PAD SIZE: 100 ...