HCS253DMSR INTERSIL [Intersil Corporation], HCS253DMSR Datasheet
HCS253DMSR
Related parts for HCS253DMSR
HCS253DMSR Summary of contents
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... CMOS/SOS Logic Family. The HCS253MS is supplied lead Ceramic flatpack (K suffi SBDIP Package (D suffix). Ordering Information PART NUMBER TEMPERATURE RANGE HCS253DMSR HCS253KMSR HCS253D/Sample HCS253K/Sample HCS253HMSR CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. ...
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Functional Diagram 20E 2I3 2I2 20E 20E 16 VCC 8 GND p 20E SELECT INPUTS Select inputs ...
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Absolute Maximum Ratings Supply Voltage (VCC -0.5V to +7.0V Input Voltage Range, All Inputs . . ...
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TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Select to Output TPHL VCC = 4.5V TPLH Data to Output TPHL VCC = 4.5V TPLH VCC = 4.5V Enable to Output TPZH VCC = 4.5V TPZL VCC = 4.5V Disable to ...
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TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Quiescent Current ICC VCC = 5.5V, VIN = VCC or GND Output Current (Sink) IOL VCC = 4.5V, VIN = VCC or GND, VOUT = 0.4V Output Current IOH VCC ...
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CONFORMANCE GROUPS Initial Test (Preburn-In) Interim Test I (Postburn-In) Interim Test II (Postburn-In) PDA Interim Test III (Postburn-In) PDA Final Test Group A (Note 1) Group B Subgroup B-5 Subgroup B-6 Group D NOTES: 1. Alternate group A inspection in ...
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Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method ...
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AC Timing Diagrams VIH INPUT VS VIL TPLH VOH VS OUTPUT VOL TTLH VOH 80% 20% OUTPUT VOL AC VOLTAGE LEVELS PARAMETER HCS VCC 4.50 VIH 4.50 VS 2.25 VIL 0 GND 0 Three-State Low Timing Diagrams VIH INPUT VS ...
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Three-State High Timing Diagrams VIH INPUT VS VIL TPZL VOH VT OUTPUT VOZ THREE-STATE HIGH VOLTAGE LEVELS PARAMETER HCS VCC 4.50 VIH 4.50 VS 2.25 VT 2.25 VW 3.60 GND 0 All Intersil semiconductor products are manufactured, assembled and tested ...
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Die Characteristics DIE DIMENSIONS mils METALLIZATION: Type: AlSi Å Å Metal Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness: 13k 2.6k WORST CASE CURRENT DENSITY <2 A/cm BOND PAD SIZE: 100 ...