STM32F051X4 STMICROELECTRONICS [STMicroelectronics], STM32F051X4 Datasheet - Page 98

• Manufacturer Part Number: STM32F051X4
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

STM32F051x
Figure 37. UFQFPN32 - 32-lead ultra thin fine pitch quad flat no-lead package outline (5 x 5)
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device ground and must
Table 71.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
be connected. It is referred to as pin 0 in
Dim.
ddd
D2
A1
A3
E2
A
D
E
b
e
L
UFQFPN32 - 32-lead ultra thin fine pitch quad flat no-lead package (5 x 5),
package mechanical data
0.00
0.18
4.90
4.90
3.40
0.30
Min
0.5
Seating plane
Pin # 1 ID
R = 0.30
C
E2
A3
b
0.152
0.500
0.55
0.02
0.23
5.00
3.50
5.00
3.50
0.40
0.08
mm
Typ
8
1
Table 13: Pin
32
9
e
Doc ID 022265 Rev 3
Bottom view
definitions.
D2
D
Max
0.05
0.28
5.10
5.10
3.60
0.50
0.6
16
L
17
24
0.0197
0.0071
0.1929
0.1929
0.1339
0.0118
L
Min
A1
0
E
A
inches
0.0217
0.0008
0.0091
0.1969
0.1378
0.1969
0.1378
0.0197
0.0157
0.0031
Package characteristics
0.006
ddd C
Typ
A0B8_ME
(1)
0.0236
0.0020
0.0110
0.2008
0.2008
0.1417
0.0197
Max
99/105