GS-BT2416C1H STMICROELECTRONICS [STMicroelectronics], GS-BT2416C1H Datasheet
GS-BT2416C1H
Related parts for GS-BT2416C1H
GS-BT2416C1H Summary of contents
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... Class 1 modules enable wireless communication with other Bluetooth 100 m away. The GS-BT2416C1.H integrates on a unique FR4 PCB support: BT 1.2 radio and baseband, memory, 32 kHz and 13 MHz oscillator, Vreg as well PA function. The module embeds customer framework up to HCI level allowing interoperability with HCI top resident on Host ...
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... Contents Contents 1 Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 Operating ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.1 DC I/O specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 Bluetooth® section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4.1 RF performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5 Integrate firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5.2 Command interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5.3 Usage scenarios . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6.1 Antenna reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 7 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 8 Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 8 ...
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... GS-BT2416C1.H 1 Certifications ● CE compliant (IMQ Exp. opinion 0081-AREF00017) – Safety EN60950-1 (2001) – EMC EN301 489 17V1.2.1 – Radio ES 300 328 V1.6. – FCC certified on GS-BT2416C1DB (for a more exhaustive explanation, please refer to GS-BT2416C1DB application note) – FCC ID: S9NBT2416C1DB ● BQB compliant Certifications 3/19 ...
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... Maximum ratings 2 Maximum ratings 2.1 Absolute maximum ratings Absolute maximum ratings (see may occur. Sustained exposure to these limits will adversely affect device reliability. Operating ranges (see characteristics of the module. Functionality outside these limits is not implied. Table 1. Absolute maximum ratings Symbol V Module supply voltage ...
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... GS-BT2416C1.H 3 Electrical characteristics 3.1 DC I/O specification Table 3. DC input / output specification Symbol V Low level input voltage il V High level input voltage ih V Schmitt trigger hysteresis hyst V Low level output voltage ol V High level output voltage oh ® 4 Bluetooth Table 4. Bluetooth Symbol CHs Channel space ...
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... A Parameter Conditions 2.402 GHz 2.441 GHz 2.480 GHz lM- lM-Nl ≥ 3 @BER 0.1 % Parameter Conditions DH1 data packet DH3 data packet DH5 data packet Drift rate GS-BT2416C1.H Min Typ Max Unit 18 20 dBm 18 20 dBm 18 20 dBm - 36 dBm - 44 dBm - 84 dBm Min ...
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... GS-BT2416C1.H 5 Integrate firmware The GS-BT2416C1.H includes customer framework up to HCI (host control interface) Figure 1. HCI firmware implementation Serial Interface Layer UART, USB, … SCO channels – Synchronous Connection Oriented Hardware Layer Set up the physical connection 5.1 Features The module with HCI embedded is interoperable with qualified BT stack protocols and suitable for any BT applications ...
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... Keep the RF ground separate from the module supply voltage ground; the two grounds are already connected inside the module in one point, see below a possible implementation. Figure 2. Module foot print 8/19 RF gnd Module foot print Supply voltage GND GS-BT2416C1.H ...
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... GS-BT2416C1.H 6.1 Antenna reference RF output pin must be connected to an antenna which could be: ● Antenna directly printed on the pcb ● Integrated antenna as, for example, antenova ANCV12G44SAA127, pulse W3008, Yageo CAN4311153002451K. ● External antenna connected by means a SMA connector Figure 3. Antenna on PCB ● Despite of the type of antenna chosen, the connection between the RF out pin and the antenna must be executed in such a way that the connection trace must be matched to have characteristic impedance (Z0 Ω ...
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... Block diagram 7 Block diagram Figure 7. Block diagram UART USB PCM SPI I²C GPIO 10/19 32kHz 32kHz XTAL XTAL STLC2416 STLC2150 Baseband Radio chip ARM7 proc GS-BT2416C1.H RF antenna PA SW Filter LNA ...
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... GS-BT2416C1.H 8 Pin settings 8.1 Pin connections Figure 8. Pin connection diagram Pin settings 11/19 ...
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... Pin settings 8.2 Pin descriptions Table 7. Pin descriptions Pin N° Name I/O Power, ground and system signal 1 Vss --- GND 1 2 Vdd --- Module supply voltage- single 3 1V8 O 1.8 V digital supply out (test purpose left not connected 42 3V3 O 3.3 V I/O power supply out (test purpose left not connected ...
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... I/O Synchronous serial interface frame synch 38 SPI_CLK I/O Synchronous serial Interface clock 39 SPI_TXD O/T Synchronous serial Interface transmit data 40 SPI_RXD I Synchronous serial Interface receive data If not used connect to VSS1 Antenna signals 49 Vss ( RF GND) --- RF GND 2 50 +ANTENNA --- Antenna out 51 Vss (RF GND) --- RF GND 2 Description Pin settings 13/19 ...
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... Ramp down rate Time from 25 °C to peak temperature Figure 9. Soldering 14/ SMAX Preheat min) S max GS-BT2416C1.H PB free assembly 3 °C / sec max 150 °C 200 °C 60 – 100 sec 217 °C 40 – 70 sec 240 + 0 °C 10 – 20 sec 6 °C / sec 8 minutes max ...
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... These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK trademark. ...
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... Mechanical dimensions Figure 11. Land pattern 16/19 GS-BT2416C1.H ...
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... GS-BT2416C1.H 11 Ordering information scheme Table 9. Ordering information scheme ® Bluetooth modules V 1.2 compliant Class 1 Embedded HCI Ordering information scheme GS-BT 2416 C1 H 17/19 ...
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... Revision history 12 Revision history Table 10. Revision history Date 31-Aug-2006 27-May-2008 18/19 Revision 1 First release Updated: Cover page 2 Added: Section 9 on page 14 GS-BT2416C1.H Changes ...
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... GS-BT2416C1.H Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...