HEF4028BT,653 NXP Semiconductors, HEF4028BT,653 Datasheet
HEF4028BT,653
Specifications of HEF4028BT,653
HEF4028BTD-T
HEF4028BTD-T
Related parts for HEF4028BT,653
HEF4028BT,653 Summary of contents
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HEF4028B BCD to decimal decoder Rev. 06 — 25 November 2009 1. General description The HEF4028B is a 4-bit BCD to decimal decoder, a 4-bit BCO to octal decoder with active LOW enable or an 8-output (Y0 to Y7) inverting ...
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... NXP Semiconductors 5. Functional diagram Fig 1. Functional diagram Fig 2. Logic diagram HEF4028B_6 Product data sheet DECODER 001aae598 Rev. 06 — 25 November 2009 HEF4028B BCD to decimal decoder 001aae600 © NXP B.V. 2009. All rights reserved ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning Fig 3. Pin configuration 6.2 Pin description Table 2. Pin description Symbol Pin 14 10, 13, 12 Functional description [1] Table 3. Function table Inputs HEF4028B_6 Product data sheet HEF4028B 001aae599 Description output (active HIGH) ground supply voltage address input ...
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... NXP Semiconductors [1] Table 3. Function table …continued Inputs [ HIGH voltage level LOW voltage level don’t care. [2] Extraordinary states. 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage DD I input clamping current IK V input voltage ...
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... NXP Semiconductors 10. Static characteristics Table 6. Static characteristics Symbol Parameter V HIGH-level input voltage IH V LOW-level input voltage IL V HIGH-level output voltage OH V LOW-level output voltage OL I HIGH-level output current OH I LOW-level output current OL I input leakage current I I supply current DD C input capacitance I 11 ...
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... NXP Semiconductors Table 7. Dynamic characteristics ° amb Symbol Parameter Conditions t transition time see t [1] The typical values of the propagation delay and transition times are calculated from the extrapolation formulas shown (C Table 8. Dynamic power dissipation P P can be calculated from the formulas shown. V ...
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... NXP Semiconductors negative positive a. Input waveforms b. Test circuit Test data is given in Table 10. Definitions for test circuit: DUT = Device Under Test load capacitance including jig and probe capacitance termination resistance should be equal to the output impedance Z T Fig 5. Test circuit for switching times Table 10 ...
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... NXP Semiconductors 13. Package outline DIP16: plastic dual in-line package; 16 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. min. max. 1.73 mm 4.2 0.51 3.2 1.30 0.068 inches 0.17 0.02 0.13 0.051 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors 14. Abbreviations Table 11. Abbreviations Acronym Description BCD Binary Coded Decimal BCO Binary Coded Octal 15. Revision history Table 12. Revision history Document ID Release date HEF4028B_6 20091125 • Modifications: Section 9 “Recommended operating HEF4028B_5 20090707 HEF4028B_4 20090304 HEF4028B_CNV_3 19950101 HEF4028B_CNV_2 19950101 HEF4028B_6 Product data sheet ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 14 Abbreviations ...