74LV139D,112 NXP Semiconductors, 74LV139D,112 Datasheet
74LV139D,112
Specifications of 74LV139D,112
74LV139D
935067430112
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74LV139D,112 Summary of contents
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Dual 2-to-4 line decoder/demultiplexer Rev. 04 — 13 December 2007 1. General description The 74LV139 is a low-voltage Si-gate CMOS device that is pin and function compatible with 74HC139 and 74HCT139. The 74LV139 is a dual 2-to-4 line decoder/demultiplexer. ...
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... NXP Semiconductors Table 1. Ordering information Type number Package Temperature range Name 74LV139DB +125 C 74LV139PW +125 C 74LV139BQ +125 C 4. Functional diagram 1 1E 1Y0 2 1A0 1Y1 3 1A1 1Y2 1Y3 2Y0 14 2A0 2Y1 13 2A1 2Y2 2Y3 2E 15 Fig 1. Logic symbol Fig 3. Functional diagram 74LV139_4 Product data sheet … ...
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... NXP Semiconductors 5. Pinning information 5.1 Pinning 1A0 1A1 3 1Y0 4 139 5 1Y1 1Y2 6 1Y3 7 8 GND 001aad029 Fig 4. Pin configuration DIP16, SO16 and (T)SSOP16 5.2 Pin description Table 2. Pin description Symbol Pin 1E 1 1A0 2 1A1 3 1Y0 4 1Y1 5 1Y2 6 1Y3 7 GND 8 2Y3 ...
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... NXP Semiconductors 6. Functional description Table 3. Function table H = HIGH voltage level LOW voltage level don’t care Input nE nA0 Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage ...
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... NXP Semiconductors 8. Recommended operating conditions Table 5. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC V input voltage I V output voltage O T ambient temperature amb t/ V input transition rise and fall rate [1] The static characteristics are guaranteed from ...
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... NXP Semiconductors Table 6. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter V LOW-level output voltage OL I input leakage current I I supply current CC I additional supply current CC C input capacitance I [1] Typical values are measured at T 10. Dynamic characteristics Table 7. Dynamic characteristics GND = 0 V ...
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... NXP Semiconductors Table 7. Dynamic characteristics GND = 0 V; For test circuit see Figure Symbol Parameter Conditions C power dissipation capacitance V = GND [1] All typical values are measured the same as t and PLH PHL [3] Typical values are measured at nominal supply voltage (V [ used to determine the dynamic power dissipation (P ...
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... NXP Semiconductors Test data is given in Table 9. Definitions test circuit Termination resistance should be equal to output impedance Load resistance Load capacitance including jig and probe capacitance. L Fig 8. Load circuit for switching times Table 9. Test data Supply voltage Input < 3.6 V 2.7 V 4.5 V ...
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... NXP Semiconductors 12. Package outline DIP16: plastic dual in-line package; 16 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.2 0.51 3.2 inches 0.17 0.02 0.13 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors SSOP16: plastic shrink small outline package; 16 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION IEC SOT338-1 Fig 11. Package outline SOT338-1 (SSOP16) ...
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... NXP Semiconductors TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 16 terminals; body 2.5 x 3.5 x 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... Document ID Release date 74LV139_4 20071213 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Section • Section • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 4 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 14 Revision history ...