GS832018T-150I GSI [GSI Technology], GS832018T-150I Datasheet

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GS832018T-150I

Manufacturer Part Number
GS832018T-150I
Description
2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs
Manufacturer
GSI [GSI Technology]
Datasheet
100-Pin TQFP
Commercial Temp
Industrial Temp
Features
• FT pin for user-configurable flow through or pipeline
• Single Cycle Deselect (SCD) operation
• 2.5 V or 3.3 V +10%/–10% core power supply
• 2.5 V or 3.3 V I/O supply
• LBO pin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Default to Interleaved Pipeline mode
• Byte Write (BW) and/or Global Write (GW) operation
• Internal self-timed write cycle
• Automatic power-down for portable applications
• JEDEC-standard 100-lead TQFP package
• Pb-Free 100-lead TQFP package available
Functional Description
Applications
The GS832018/32/36T is a 37,748,736-bit high performance
synchronous SRAM with a 2-bit burst address counter.
Although of a type originally developed for Level 2 Cache
applications supporting high performance CPUs, the device
now finds application in synchronous SRAM applications,
ranging from DSP main store to networking chip set support.
Controls
Addresses, data I/Os, chip enables (E1, E2, E3), address burst
control inputs (ADSP, ADSC, ADV), and write control inputs
(Bx, BW, GW) are synchronous and are controlled by a
positive-edge-triggered clock input (CK). Output enable (G)
and power down control (ZZ) are asynchronous inputs. Burst
Rev: 1.02 10/2004
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
operation
Through
Pipeline
3-1-1-1
2-1-1-1
Flow
2M x 18, 1M x 32, 1M x 36
36Mb Sync Burst SRAMs
Curr
Curr
Curr
Curr
tCycle
tCycle
t
t
(x32/x36)
(x32/x36)
KQ
KQ
(x18)
(x18)
Parameter Synopsis
1/25
-250 -225 -200 -166 -150 -133 Unit
285
350
205
235
2.5
4.0
6.5
6.5
265
320
195
225
2.7
4.4
7.0
7.0
cycles can be initiated with either ADSP or ADSC inputs. In
Burst mode, subsequent burst addresses are generated
internally and are controlled by ADV. The burst address
counter may be configured to count in either linear or
interleave order with the Linear Burst Order (LBO) input. The
Burst function need not be used. New addresses can be loaded
on every cycle with no degradation of chip performance.
Flow Through/Pipeline Reads
The function of the Data Output register can be controlled by
the user via the FT mode pin (Pin 14). Holding the FT mode
pin low places the RAM in Flow Through mode, causing
output data to bypass the Data Output Register. Holding FT
high places the RAM in Pipeline mode, activating the rising-
edge-triggered Data Output Register.
Byte Write and Global Write
Byte write operation is performed by using Byte Write enable
(BW) input combined with one or more individual byte write
signals (Bx). In addition, Global Write (GW) is available for
writing all bytes at one time, regardless of the Byte Write
control inputs.
Sleep Mode
Low power (Sleep mode) is attained through the assertion
(High) of the ZZ signal, or by stopping the clock (CK).
Memory data is retained during Sleep mode.
Core and Interface Voltages
The GS832018/32/36T operates on a 2.5 V or 3.3 V power
supply. All input are 3.3 V and 2.5 V compatible. Separate
output power (V
from the internal circuits and are 3.3 V and 2.5 V compatible.
245
295
185
210
3.0
5.0
7.5
7.5
GS832018/32/36T-250/225/200/166/150/133
220
260
175
200
3.5
6.0
8.0
8.0
210
240
165
190
3.8
6.6
8.5
8.5
DDQ
185
215
155
175
4.0
7.5
8.5
8.5
) pins are used to decouple output noise
mA
mA
mA
mA
ns
ns
ns
ns
© 2003, GSI Technology
250 MHz–133 MHz
2.5 V or 3.3 V V
2.5 V or 3.3 V I/O
Preliminary
DD

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GS832018T-150I Summary of contents

Page 1

... Pb-Free 100-lead TQFP package available Functional Description Applications The GS832018/32/36T is a 37,748,736-bit high performance synchronous SRAM with a 2-bit burst address counter. Although of a type originally developed for Level 2 Cache applications supporting high performance CPUs, the device now finds application in synchronous SRAM applications, ranging from DSP main store to networking chip set support ...

Page 2

DDQ ...

Page 3

DDQ ...

Page 4

DQP DDQ ...

Page 5

TQFP Pin Description Symbol Type I ...

Page 6

Register – LBO ADV CK ADSC ADSP Power Down ZZ Control Note: Only x36 version shown ...

Page 7

Mode Pin Functions Mode Name Burst Order Control Output Register Control Power Down Control Note: There is a pull-up device on the FT pin and a pull-down device on the ZZ pin, so this input pin can be unconnected and ...

Page 8

Byte Write Truth Table Function GW Read H Read H Write byte a H Write byte b H Write byte c H Write byte d H Write all bytes H Write all bytes L Notes: 1. All byte outputs are ...

Page 9

Synchronous Truth Table Address Operation Used Deselect Cycle, Power Down Deselect Cycle, Power Down Deselect Cycle, Power Down Read Cycle, Begin Burst External Read Cycle, Begin Burst External Write Cycle, Begin Burst External Read Cycle, Continue Burst Read Cycle, Continue ...

Page 10

Notes: 1. The diagram shows only supported (tested) synchronous state transitions. The diagram presumes G is tied low. 2. The upper portion of the diagram assumes active use of only the Enable (E1, E2, and E3) and Write (B control ...

Page 11

Notes: 1. The diagram shows supported (tested) synchronous state transitions plus supported transitions that depend upon the use Use of “Dummy Reads” (Read Cycles with G High) may be used to make the transition from Read cycles ...

Page 12

Absolute Maximum Ratings (All voltages reference Symbol DDQ V I/O V Voltage on Other Input Pins IN I Input Current on Any Pin IN I Output Current on Any I/O Pin OUT P ...

Page 13

V Range Logic Levels DDQ3 Parameter V Input High Voltage DD V Input Low Voltage DD V I/O Input High Voltage DDQ V I/O Input Low Voltage DDQ Notes: 1. The part numbers of Industrial Temperature Range versions end the ...

Page 14

Undershoot Measurement and Timing 50% V – 2 20% tKC Capacitance 2 Parameter Input Capacitance Input/Output Capacitance Note: ...

Page 15

DC Electrical Characteristics Parameter Input Leakage Current (except mode pins) ZZInput Current FTInput Current Output Leakage Current (x36/x72) Output Leakage Current (x18) Output High Voltage Output High Voltage Output Low Voltage Rev: 1.02 10/2004 Specifications cited are subject to change ...

Page 16

Rev: 1.02 10/2004 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS832018/32/36T-250/225/200/166/150/133 16/25 Preliminary © 2003, GSI Technology ...

Page 17

AC Electrical Characteristics Parameter Symbol Clock Cycle Time Clock to Output Valid Clock to Output Invalid Pipeline Clock to Output in Low-Z Setup time Hold time Clock Cycle Time Clock to Output Valid Clock to Output Invalid Flow Through Clock ...

Page 18

Begin Read A Cont Single Read Single Read CK ADSP tS tH ADSC tS ADV tS tH A0– Ba– tOE DQa–DQd Rev: 1.02 10/2004 Specifications cited ...

Page 19

Begin Read A Cont tKH tKH CK ADSP tS tH ADSC tS tH ADV tS tH A0– Ba– and E3 only sampled with ADSC tOE ...

Page 20

... During normal operation, ZZ must be pulled low, either by the user or by its internal pull down resistor. When ZZ is pulled high, the SRAM will enter a Power Sleep mode after 2 cycles. At this time, internal state of the SRAM is preserved. When ZZ returns to low, the SRAM operates normally after 2 cycles of wake up time. ...

Page 21

TQFP Package Drawing (Package T) Symbol Description Min. Nom. Max A1 Standoff 0.05 A2 Body Thickness 1.35 b Lead Width 0.20 c Lead Thickness 0.09 D Terminal Dimension 21.9 D1 Package Body 19.9 E Terminal Dimension 15.9 E1 Package Body ...

Page 22

... GS832032T-150I Notes: 1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS832018T-150IT. 2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each device is Pipeline/Flow Through mode-selectable by the user ...

Page 23

... GS832018GT-133I Notes: 1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS832018T-150IT. 2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each device is Pipeline/Flow Through mode-selectable by the user ...

Page 24

... GS832036GT-133I Notes: 1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS832018T-150IT. 2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each device is Pipeline/Flow Through mode-selectable by the user ...

Page 25

... Sync SRAM Datasheet Revision History DS/DateRev. Code: Old; Types of Changes New Format or Content 832018_r1 832018_r1; 832018_r1_01 832018_r1_01; 832018_r1_02 Rev: 1.02 10/2004 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS832018/32/36T-250/225/200/166/150/133 • Creation of new datasheet • Updated AC Characteristics table • ...

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